摘要:
The object of the present invention is to establish a technology for directly evaluating polishing pad surface conditions, to allow high-precision CMP process management, and to improve process throughput. The pad surface is illuminated with light. The intensity of reflected light or fluorescence from the illuminated area or an intensity distribution image is used directly evaluate the pad surface condition. Based on the results of this evaluation, conditioning conditions for a conditioner are optimized, thus allowing high-precision CMP processing while maintaining good pad surface conditions.
摘要:
A projecting apparatus for forming an image of a mask on a wafer by a projector of a unit magnification reflection system having a concave spherical mirror and a convex spherical mirror. The distance from the projector to the mask or the upper side of a mask holder for holding the mask and the distance from the projector to the wafer are measured. An error of the image-forming position is computed from the distance measurements. At least one of the mask, the wafer and the projector is moved along the direction of projection in a manner to eliminate the error of the image-forming position computed, thus attaining automatic focus adjustment.
摘要:
A pattern checking apparatus carries out the detection of candidate defects through a primary selection with a sensitivity high enough to detect any existing defect, and then carries out a detailed analysis by a controlling processor for a pattern including the periphery of the detected candidate defect through a secondary selection in which a candidate defect which is not a defect in a practical sense is removed from candidates, so that only real defects are detected.
摘要:
A light exposure device and method for exposing and printing a predetermined pattern on an exposure surface of a substrate comprises measuring means for measuring curvature of the exposure surface of the substrate, a chuck including suck and hold means for sucking and holding a back surface of the substrate opposite to the exposure surface and deforming means for imparting a force to the back surface of the substrate to deform the substrate, and control means for controlling the deforming means of the chuck in accordance with the curvature of the exposure surface of the substrate measured by the measuring means such that the exposure surface of the substrate conforms to an image surface of the pattern over an entire exposure area within a predetermined allowable error.
摘要:
A continuous sputtering apparatus comprising a main vacuum chamber, one loading station and a plurality of process stations capable of having their pressures controlled separately. The process station includes a sub vacuum chamber capable of being in communication with the main vacuum chamber through an opening and an evacuation port. The loading station and the process stations are arranged to be spaced with equal angles. Substrate holders are provided to face the stations and are rotated by said equal angle in a time. The substrate holder opens and closes the opening of the sub vacuum chamber to serve as a gate valve.
摘要:
An apparatus for performing continuous treatment in vacuum including an inlet chamber, a first intermediate chamber, at least one vacuum treating chamber, a second intermediate chamber and a withdrawing chamber arranged in the indicated order in a direction in which base plates are successively transferred. An opening device normally closed and opened when a base plate is transferred therethrough is mounted on a wall at the inlet of the inlet chamber, between the adjacent chambers and on a wall at the outlet side of the withdrawing chamber. A conveyor device for conveying each base plate in a horizontal direction through the opening device is mounted in each of the chambers, and an evacuating device is also mounted in each chamber. A base plate storing device for storing a plurality of base plates in a magazine is mounted in the first and second intermediate chambers. At least one vacuum treating device is mounted in the vacuum treating chamber.
摘要:
An alignment apparatus, in which a mask is overlaid on a wafer and a relative displacement between the wafer and a target pattern formed on the mask is detected to effect alignment thereof, comprises a slit frame adapted to reciprocate in a direction substantially parallel to the top surface of the mask and having a slit formed therein, an illumination optical system for illuminating the target pattern, an image formation optical system for forming the image of the target pattern onto the slit of the slit frame, a light sensing element mounted on the slit frame for detecting the target pattern image formed by the image formation optical system through the slit to convert the image into an electric signal, and a displacement detector for detecting the amount of movement of the reciprocation of the slit frame to convert the amount of movement into a position signal which the light sensing element scans, whereby the output signals from the displacement detector and the light sensing element are used to detect the relative position between the mask and the target pattern on the wafer and the mask is moved relative to the wafer such that the relative displacement amount becomes zero.
摘要:
A method for repairing a liquid crystal display provided with a light transmitting member having an image display section. The method includes filling a filler, which has a refractive index substantially equal to that of the light transmitting member, into a scratch or scratches formed on inside and outside surfaces of the light transmitting member so as to repair the scratch or scratches.
摘要:
The present invention relates to a method and apparatus for correcting defects of an X-ray mask which includes a focused ion beam used to irradiate at least a region having a defective portion of an X-ray mask having a protective film and eliminating the protective film; exposing a circuit pattern having a defective portion located under the region or setting this circuit pattern to the state near the exposure; detecting one of the secondary electrons, secondary ions, reflected electrons, or absorbing current generated from that region and detecting a true defective position. Then positioning the focused ion beam to the true defective position and irradiating the focused ion beam to the defective portion thereby correcting the defect.
摘要:
Method for forming thin films on a substrate by using a mask through dry process wherein the substrate and the mask are moved relative to each other at least once for the formation of a thin film before the thickness of the thin film being formed on the substrate reaches a predetermined value, so that the formed thin film has an outer edge partly or entirely contoured stepwise.