Invention Grant
US07022458B2 Photoresist polymer and photoresist composition containing the same
有权
光致抗蚀剂聚合物和含有它的光致抗蚀剂组合物
- Patent Title: Photoresist polymer and photoresist composition containing the same
- Patent Title (中): 光致抗蚀剂聚合物和含有它的光致抗蚀剂组合物
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Application No.: US10719905Application Date: 2003-11-21
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Publication No.: US07022458B2Publication Date: 2006-04-04
- Inventor: Geun Su Lee , Cheol Kyu Bok , Seung Chan Moon , Ki Soo Shin , Jae Hyun Kim , Jung Woo Kim , Sang Hyang Lee , Jae Hyun Kang
- Applicant: Geun Su Lee , Cheol Kyu Bok , Seung Chan Moon , Ki Soo Shin , Jae Hyun Kim , Jung Woo Kim , Sang Hyang Lee , Jae Hyun Kang
- Applicant Address: KR Gyeonggi-Do KR Incheon
- Assignee: Hynix Semiconductor Inc.,Dongjin Semichem Co., Ltd.
- Current Assignee: Hynix Semiconductor Inc.,Dongjin Semichem Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do KR Incheon
- Agency: Marshall, Gerstein & Borun LLP
- Priority: KR10-20030052337 20030729
- Main IPC: G03F7/004
- IPC: G03F7/004 ; C08F10/00

Abstract:
Photoresist polymers and photoresist compositions are disclosed. A photoresist polymer represented by Formula 1 and a photoresist composition containing the same have excellent etching resistance, thermal resistance and adhesive property, and high affinity to an developing solution, thereby improving LER (line edge roughness). wherein X1, X2, X3, R1, R2, R3, R4, R5, m, n, o, a, b, c, d and e are as defined in the description.
Public/Granted literature
- US20050026070A1 Photoresist polymer and photoresist composition containing the same Public/Granted day:2005-02-03
Information query
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