Method for manufacturing a semiconductor device
    1.
    发明授权
    Method for manufacturing a semiconductor device 失效
    半导体器件的制造方法

    公开(公告)号:US08685627B2

    公开(公告)日:2014-04-01

    申请号:US12266459

    申请日:2008-11-06

    IPC分类号: H01L21/02

    CPC分类号: H01L21/308 H01L21/0337

    摘要: A method for manufacturing a semiconductor device includes forming an etch-target layer over a semiconductor substrate having a lower structure, forming a first mask pattern over the etch-target layer, forming a spacer material layer with a uniform thickness over the etch-target layer including the first mask pattern, forming a second mask pattern on an indented region of the space material layer, and etching the etch-target layer with the first mask pattern and the second mask pattern as an etch mask to form a fine pattern.

    摘要翻译: 一种用于制造半导体器件的方法包括在具有较低结构的半导体衬底上形成蚀刻目标层,在蚀刻靶层上形成第一掩模图案,在蚀刻靶层上形成均匀厚度的间隔物材料层 包括第一掩模图案,在空间材料层的凹陷区域上形成第二掩模图案,并且用第一掩模图案和第二掩模图案蚀刻蚀刻目标层作为蚀刻掩模以形成精细图案。

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    2.
    发明申请
    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 有权
    制造半导体器件的方法

    公开(公告)号:US20120289051A1

    公开(公告)日:2012-11-15

    申请号:US13347531

    申请日:2012-01-10

    IPC分类号: H01L21/3105 H01L21/31

    摘要: A method of manufacturing a semiconductor device is provided. According to an embodiment, the method includes forming a layer to be etched on a semiconductor substrate, and forming a photoresist pattern on the layer to be etched. A block copolymer including a hydrophobic radical and a hydrophilic radical is formed in the photoresist pattern, and the block copolymer is assembled to allow a polymer having the hydrophobic radical to be formed in a pillar pattern within a polymer having the hydrophilic radical. The polymer having the hydrophobic radical is then selectively removed.

    摘要翻译: 提供一种制造半导体器件的方法。 根据实施例,该方法包括在半导体衬底上形成待蚀刻的层,并在待蚀刻的层上形成光刻胶图案。 在光致抗蚀剂图案中形成包括疏水基团和亲水基团的嵌段共聚物,并且组合嵌段共聚物以允许具有疏水基团的聚合物以具有亲水基团的聚合物中的柱状图案形成。 然后选择性地除去具有疏水基团的聚合物。

    Method for forming fine pattern of semiconductor device
    3.
    发明授权
    Method for forming fine pattern of semiconductor device 失效
    用于形成半导体器件精细图案的方法

    公开(公告)号:US07972766B2

    公开(公告)日:2011-07-05

    申请号:US11962405

    申请日:2007-12-21

    申请人: Cheol Kyu Bok

    发明人: Cheol Kyu Bok

    IPC分类号: G03F7/26

    摘要: A method for forming a fine pattern of a semiconductor device comprises: forming anti-reflection coating patterns over an underlying layer of a semiconductor substrate using an anti-reflection coating composition comprising a silicon-containing polymer; forming a photoresist pattern between the anti-reflection coating patterns using a photoresist composition comprising a silicon-containing polymer; and patterning the underlying layer using the photoresist patterns as an etching mask.

    摘要翻译: 一种用于形成半导体器件的精细图案的方法包括:使用包含含硅聚合物的抗反射涂层组合物在半导体衬底的下层上形成抗反射涂层图案; 使用包含含硅聚合物的光致抗蚀剂组合物在抗反射涂层图案之间形成光致抗蚀剂图案; 并使用光致抗蚀剂图案作为蚀刻掩模来图案化底层。

    Method for forming a photoresist pattern
    5.
    发明授权
    Method for forming a photoresist pattern 失效
    形成光致抗蚀剂图案的方法

    公开(公告)号:US07467632B2

    公开(公告)日:2008-12-23

    申请号:US11650141

    申请日:2007-01-04

    IPC分类号: B08B3/04 C11D3/28 C11D1/00

    CPC分类号: C11D11/0047 C11D1/58

    摘要: A photoresist cleaning solution and method for forming photoresist patterns using the same. More specifically, disclosed are a photoresist cleaning solution comprising H2O and an ionic surfactant represented by Formula 1, and a method for forming a photoresist pattern using the same. By spraying the cleaning solution of the present invention over photoresist film before and/or after exposing step, pattern formation in an undesired region caused by ghost images can be removed.

    摘要翻译: 光致抗蚀剂清洁溶液和使用其形成光致抗蚀剂图案的方法。 更具体地,公开了包含H 2 O和由式1表示的离子表面活性剂的光致抗蚀剂清洁溶液,以及使用其形成光刻胶图案的方法。 通过在曝光步骤之前和/或之后将本发明的清洁溶液喷涂在光致抗蚀剂膜上,可以除去由重影图像引起的不需要的区域中的图案形成。

    Method for Forming Fine Pattern of Semiconductor Device
    6.
    发明申请
    Method for Forming Fine Pattern of Semiconductor Device 失效
    形成半导体器件精细图案的方法

    公开(公告)号:US20080272467A1

    公开(公告)日:2008-11-06

    申请号:US11964988

    申请日:2007-12-27

    IPC分类号: H01L21/306 H01L29/06

    摘要: A method for forming a fine pattern of a semiconductor device includes forming a deposition film over a substrate having an underlying layer. The deposition film includes first, second, and third mask films. The method also includes forming a photoresist pattern over the third mask film, patterning the third mask film to form a deposition pattern, and forming an amorphous carbon pattern at sidewalls of the deposition pattern. The method further includes filling a spin-on-carbon layer over the deposition pattern and the amorphous carbon pattern, polishing the spin-on-carbon layer, the amorphous carbon pattern, and the photoresist pattern to expose the third mask pattern, and performing an etching process to expose the first mask film with the amorphous carbon pattern as an etching mask. The etching process removes the third mask pattern and the exposed second mask pattern. The method also includes removing the spin-on-carbon layer and the amorphous carbon pattern, and forming a first mask pattern with the second mask pattern as an etching mask.

    摘要翻译: 用于形成半导体器件的精细图案的方法包括在具有下层的衬底上形成沉积膜。 沉积膜包括第一,第二和第三掩模膜。 该方法还包括在第三掩模膜上形成光致抗蚀剂图案,图案化第三掩模膜以形成沉积图案,并在沉积图案的侧壁处形成无定形碳图案。 该方法还包括在沉积图案和无定形碳图案上填充旋涂碳层,研磨自旋碳层,无定形碳图案和光致抗蚀剂图案以暴露第三掩模图案,并执行 蚀刻工艺以将无定形碳图案的第一掩模膜暴露为蚀刻掩模。 蚀刻工艺去除第三掩模图案和暴露的第二掩模图案。 该方法还包括除去碳 - 碳层和无定形碳图案,并且用第二掩模图案形成第一掩模图案作为蚀刻掩模。

    METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    7.
    发明申请
    METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 有权
    制造半导体器件的方法

    公开(公告)号:US20080160770A1

    公开(公告)日:2008-07-03

    申请号:US11771651

    申请日:2007-06-29

    申请人: Cheol Kyu BOK

    发明人: Cheol Kyu BOK

    IPC分类号: H01L21/311

    摘要: A method for manufacturing a semiconductor device includes forming an underlying layer over a semiconductor substrate; forming a hard mask layer over the underlying layer; forming first etch patterns over the hard mask layer; forming second etch patterns between the first photoresist patterns; etching the hard mask layer using the first and second etch patterns as an etch mask to form a hard mask pattern; and etching the underlying layer using at least the hard mask pattern. The first and second etch patterns are formed on the same layer.

    摘要翻译: 一种半导体器件的制造方法,包括在半导体衬底上形成下层; 在下层上形成硬掩模层; 在硬掩模层上形成第一蚀刻图案; 在所述第一光致抗蚀剂图案之间形成第二蚀刻图案; 使用第一和第二蚀刻图案作为蚀刻掩模蚀刻硬掩模层以形成硬掩模图案; 以及使用至少所述硬掩模图案蚀刻所述下层。 第一和第二蚀刻图案形成在同一层上。

    Cleaning solution for photoresist and method for forming pattern using the same
    10.
    发明授权
    Cleaning solution for photoresist and method for forming pattern using the same 有权
    用于光致抗蚀剂的清洁溶液和使用其形成图案的方法

    公开(公告)号:US07238653B2

    公开(公告)日:2007-07-03

    申请号:US10723029

    申请日:2003-11-26

    IPC分类号: C11D1/72

    摘要: Cleaning solutions for photoresist are disclosed which are useful for cleaning a semiconductor substrate in the last step of development when photoresist patterns are formed. Also, methods for forming photoresist patterns using the same are disclosed. The disclosed cleaning solution comprises H2O as a solution, a surfactant which is phosphate-alcoholamine salt represented by Formula 1, and an alcohol compound. The disclosed cleaning solution has lower surface tension than that of distilled water which has been used for conventional cleaning solutions, thereby improving resistance to photoresist pattern collapse and stabilizing the photoresist pattern formation. wherein R, x, y, z, a and b are as defined in the specification.

    摘要翻译: 公开了用于光致抗蚀剂的清洁溶液,其在形成光致抗蚀剂图案时在开发的最后步骤中用于清洁半导体衬底。 此外,公开了使用其形成光致抗蚀剂图案的方法。 所公开的洗涤溶液包含作为溶液的H 2 O 2,作为由式1表示的磷酸 - 醇胺盐的表面活性剂和醇化合物。 所公开的清洗溶液具有比用于常规清洁溶液的蒸馏水低的表面张力,从而提高抗光刻胶图案的崩溃和稳定光致抗蚀剂图案形成。 其中R,x,y,z,a和b如说明书中所定义。