Invention Grant
- Patent Title: Housing for temperature sensing assemblies in a thermometer
- Patent Title (中): 温度计温度传感组件的外壳
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Application No.: US10734733Application Date: 2003-12-12
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Publication No.: US07026909B2Publication Date: 2006-04-11
- Inventor: Irene Glozman , Richard W. Phillips , James R. Powell
- Applicant: Irene Glozman , Richard W. Phillips , James R. Powell
- Applicant Address: US MN Burnsville
- Assignee: Rosemount Aerospace, Inc.
- Current Assignee: Rosemount Aerospace, Inc.
- Current Assignee Address: US MN Burnsville
- Agency: Westman, Champlin & Kelly, P.A.
- Main IPC: H01H7/02
- IPC: H01H7/02
Abstract:
A platinum resistance thermometer has an outer housing with a bore that receives a temperature sensor assembly including a mandrel having a sensing section with a platinum wire wound thereon and supported in the bore with a non-cohesive powder material that will distribute stresses caused by differential thermal expansion between the housing and the temperature sensor assembly. A second portion of the mandrel is supported in the bore with a rigid epoxy to mechanically support the sensor assembly with the sensing section cantilevered from the rigid epoxy.
Public/Granted literature
- US20050129089A1 Housing for temperature sensing assemblies in a thermometer Public/Granted day:2005-06-16
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