An optical chip module has an optical chip on an element forming face with a light emitting or a light receiving element and terminals for electrical connection with the element and an optical fiber optically bonded to the element with its end face abutting the element. The outer circumference of the optical fiber has interconnect patterns extending from the end face, and in the axial direction, of the optical fiber and electrically connected with the terminals. Terminals of the optical chip are connected with the interconnect patterns at the end face of the optical fiber, intersecting circumferential lines of the end face of the optical fiber abutting against the element forming face and bonded thereto.