Invention Grant
- Patent Title: Method for cutting a block of material and forming a thin film
- Patent Title (中): 切割材料块并形成薄膜的方法
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Application No.: US10312864Application Date: 2001-07-11
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Publication No.: US07029548B2Publication Date: 2006-04-18
- Inventor: Bernard Aspar , Chrystelle Lagache
- Applicant: Bernard Aspar , Chrystelle Lagache
- Applicant Address: FR Paris
- Assignee: Commissariat a l'Energie Atomique
- Current Assignee: Commissariat a l'Energie Atomique
- Current Assignee Address: FR Paris
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- Priority: FR0009129 20000712
- International Application: PCT/FR01/02239 WO 20010711
- International Announcement: WO02/05344 WO 20020117
- Main IPC: B32B35/00
- IPC: B32B35/00

Abstract:
A process for cutting out a block of material includes a step of introducing ions in the block thereby forming an embrittled zone and defining at least one superficial part of the block. The method also includes a step of forming at least one separation initiator at the level of the embrittled zone, wherein the step of forming the separation initiator includes implanting ions of an ionic nature different from that introduced during the preceding step. The method further includes a step of separating at the level of the embrittled zone the superficial part of the block from a remaining part of the block from the separation initiator, wherein the separation step includes at least one of a thermal treatment and the application of mechanical forces acting between the superficial part and the embrittled zone.
Public/Granted literature
- US20030234075A1 Method for cutting a block of material and forming a thin film Public/Granted day:2003-12-25
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