Invention Grant
- Patent Title: Split gate type nonvolatile semiconductor memory device, and method of fabricating the same
- Patent Title (中): 分路型非易失性半导体存储器件及其制造方法
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Application No.: US11083130Application Date: 2005-03-17
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Publication No.: US07029974B2Publication Date: 2006-04-18
- Inventor: Heeseog Jeon , Seung-beom Yoon , Yong-tae Kim , Yong-suk Choi
- Applicant: Heeseog Jeon , Seung-beom Yoon , Yong-tae Kim , Yong-suk Choi
- Applicant Address: KR
- Assignee: Samsung Electronics, Co., Ltd.
- Current Assignee: Samsung Electronics, Co., Ltd.
- Current Assignee Address: KR
- Agency: Mills & Onello, LLP
- Priority: KR10-2004-0018289 20040318
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A split gate type nonvolatile semiconductor memory device and a method of fabricating a split gate type nonvolatile semiconductor memory device are provided. A gate insulating layer and a floating-gate conductive layer are formed on a semiconductor substrate. A mask layer pattern is formed on the floating-gate conductive layer to define a first opening extending in a first direction. First sacrificial spacers having a predetermined width are formed on both sidewalls corresponding to the mask layer pattern. An inter-gate insulating layer is formed on the floating-gate conductive layer. The first sacrificial spacers are removed, and the floating-gate conductive layer is etched until the gate insulating layer is exposed. A tunneling insulating layer is formed on an exposed portion of the floating-gate conductive layer. A control-gate conductive layer is formed on a surface of the semiconductor substrate. Second sacrificial spacers having predetermined widths are formed on the control-gate conductive layer. A split control gate is formed in the first opening, by etching the exposed control-gate conductive layer. The remaining mask layer pattern and inter-gate insulating layer are etched until the floating-gate conductive layer is exposed. The exposed floating-gate conductive layer is etched to form a split floating gate in the first opening.
Public/Granted literature
- US20050208744A1 Split gate type nonvolatile semiconductor memory device, and method of fabricating the same Public/Granted day:2005-09-22
Information query
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