Invention Grant
- Patent Title: Switch contact structure and method for manufacturing switch contact
- Patent Title (中): 开关接触结构和开关接触方法
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Application No.: US10898831Application Date: 2004-07-26
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Publication No.: US07034239B2Publication Date: 2006-04-25
- Inventor: Mamoru Miyako
- Applicant: Mamoru Miyako
- Applicant Address: JP Aichi
- Assignee: Kabushiki Kaisha Tokai Rika Denki Seisakusho
- Current Assignee: Kabushiki Kaisha Tokai Rika Denki Seisakusho
- Current Assignee Address: JP Aichi
- Agency: Crompton, Seager & Tufte, LLC
- Priority: JP2003-282752 20030730; JP2004-191780 20040629
- Main IPC: H01H1/10
- IPC: H01H1/10

Abstract:
A contact structure for a switch that ensures stable electrical connection. The contact structure includes a substrate. A first fixed contact and a second fixed contact are arranged on the substrate and spaced from each other. An elastically deformable movable contact engages and disengages the first and second fixed contacts. The movable contact includes a recess. A conductive member is arranged on the movable contact for electrically connecting the first and second fixed contacts when the movable contact engages the first and second fixed contacts.
Public/Granted literature
- US20050023123A1 Switch contact structure and method for manufacturing switch contact Public/Granted day:2005-02-03
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