发明授权
US07035004B2 Laser microdissection device 有权
激光显微切割装置

Laser microdissection device
摘要:
The invention relates to a laser microdissection device comprised of a microscope table (1), which supports a specimen (3) to be dissected, of an incident lighting device (7), a laser light source (5) and of an objective (10) for focussing the laser beam (18) of the laser light source (5) onto the specimen (3). According to the invention, the microscope table (1) is not moved during the dissecting process. A laser scanning device (9) is arranged in the incident lighting device (7), is comprised of two thick glass wedge plates (11a, 11b), which are tilted toward the optical axis (8) and can be rotated independently of one another around said optical axis (8). In addition to the beam deviation caused by the wedge angle of the wedge plates (11a, 11b), a beam offset of the laser beam (18) is produced by the thickness and the tilt of the wedge plates (11a, 11b). When both wedge plates (11a, 11b) are rotated, the beam deviation and the beam offset of the laser beam (18) are varied in such a manner that the laser beam (18) always passes through the middle of the objective pupil (19) and, at the same time, the beam is guided over the specimen (3) to be dissected by the beam deviation of the laser beam (18).
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