发明授权
- 专利标题: Laser microdissection device
- 专利标题(中): 激光显微切割装置
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申请号: US10257673申请日: 2001-03-29
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公开(公告)号: US07035004B2公开(公告)日: 2006-04-25
- 发明人: Albrecht Weiss
- 申请人: Albrecht Weiss
- 申请人地址: DE Wetzlar
- 专利权人: Leica Microsystems Wetzlar GmbH
- 当前专利权人: Leica Microsystems Wetzlar GmbH
- 当前专利权人地址: DE Wetzlar
- 代理机构: Foley & Lardner LLP
- 优先权: DE10018253 20000413
- 国际申请: PCT/DE01/01227 WO 20010329
- 国际公布: WO01/78937 WO 20011025
- 主分类号: G02B21/06
- IPC分类号: G02B21/06
摘要:
The invention relates to a laser microdissection device comprised of a microscope table (1), which supports a specimen (3) to be dissected, of an incident lighting device (7), a laser light source (5) and of an objective (10) for focussing the laser beam (18) of the laser light source (5) onto the specimen (3). According to the invention, the microscope table (1) is not moved during the dissecting process. A laser scanning device (9) is arranged in the incident lighting device (7), is comprised of two thick glass wedge plates (11a, 11b), which are tilted toward the optical axis (8) and can be rotated independently of one another around said optical axis (8). In addition to the beam deviation caused by the wedge angle of the wedge plates (11a, 11b), a beam offset of the laser beam (18) is produced by the thickness and the tilt of the wedge plates (11a, 11b). When both wedge plates (11a, 11b) are rotated, the beam deviation and the beam offset of the laser beam (18) are varied in such a manner that the laser beam (18) always passes through the middle of the objective pupil (19) and, at the same time, the beam is guided over the specimen (3) to be dissected by the beam deviation of the laser beam (18).
公开/授权文献
- US20030133190A1 Laser microdissection device 公开/授权日:2003-07-17
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