发明授权
- 专利标题： Power module with improved heat dissipation
- 专利标题（中）： 功率模块具有改善的散热性能
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申请号： US09587768申请日： 2000-06-06
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公开(公告)号： US07038310B1公开(公告)日： 2006-05-02
- 发明人: Seiichi Nakatani , Koichi Hirano , Mitsuhiro Matsuo , Hiroyuki Handa
- 申请人： Seiichi Nakatani , Koichi Hirano , Mitsuhiro Matsuo , Hiroyuki Handa
- 申请人地址： JP Osaka
- 专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： Hamre, Schumann, Mueller & Larson, P.C.
- 优先权： JP11-162541 19990609
- 主分类号： H01L23/10
- IPC分类号： H01L23/10 ; H01L23/34
摘要：
The invention provides a power module that is excellent in heat dissipation and suitable for the trend of miniaturization with high density, and provides also a method of manufacturing the same. The power module includes an insulating layer including an inorganic filler and a thermosetting resin composition, a lead formed on the surface of the insulating layer, and a semiconductor chip mounted on a insulating layer side of the lead, and a heat sink formed on the backside of the insulating layer. The semiconductor chip is mounted on the lead by flip-chip bonding and sealed in the insulating layer.
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