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    Thermal conductive substrate and the method for manufacturing the same
    2.
    发明授权
    Thermal conductive substrate and the method for manufacturing the same 有权
    导热基板及其制造方法

    公开(公告)号：US06570099B1

    公开(公告)日：2003-05-27

    申请号：US09694445

    申请日：2000-10-23

    申请人： Koichi Hirano ,  Seiichi Nakatani ,  Mitsuhiro Matsuo ,  Hiroyuki Handa ,  Yoshihisa Yamashita

    发明人： Koichi Hirano ,  Seiichi Nakatani ,  Mitsuhiro Matsuo ,  Hiroyuki Handa ,  Yoshihisa Yamashita

    IPC分类号： H05K100

    CPC分类号： H01L23/49861 ,  H01L23/36 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/036 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/056 ,  H05K3/202 ,  H05K2201/0209 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/253 ,  H01L2924/00

    摘要： A thermal conductive substrate includes a first electrical insulator layer, a second electrical insulator layer and a lead frame serving as a circuit pattern. The first electrical insulator layer is formed of a thermal conductive resin composition containing a thermosetting resin and an inorganic filler, and is joined to the lead frame. The second electrical insulator layer is provided on the side of the first electrical insulator layer not in contact with the lead frame, and is formed of a thermal conductive resin composition containing the inorganic filler and a resin composition containing the thermosetting resin. The second electrical insulator layer has a higher thermal conductivity than the first electrical insulator layer. Thus, it is possible to achieve higher heat-radiating characteristics and component packaging reliability without deteriorating formability and adhesive characteristics of the electrical insulator layers.

    摘要翻译： 导热基板包括第一电绝缘体层，第二电绝缘体层和用作电路图案的引线框架。 第一电绝缘体层由含有热固性树脂和无机填料的导热性树脂组合物形成，并与引线框架接合。 第二电绝缘体层设置在不与引线框架接触的第一电绝缘体层的一侧，并且由含有无机填料的热导性树脂组合物和含有该热固性树脂的树脂组合物形成。 第二电绝缘体层具有比第一电绝缘体层更高的热导率。 因此，可以在不降低电绝缘体层的成形性和粘合特性的情况下实现更高的散热特性和部件封装可靠性。

    Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same
    3.
    发明授权
    Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same 有权
    电容器及其制造方法以及具有内置电容器的电路板及其制造方法

    公开(公告)号：US07247178B2

    公开(公告)日：2007-07-24

    申请号：US11523574

    申请日：2006-09-20

    申请人： Koichi Hirano ,  Tsunenori Yoshida ,  Hiroyuki Handa ,  Yoshihisa Yamashita ,  Seiichi Nakatani

    发明人： Koichi Hirano ,  Tsunenori Yoshida ,  Hiroyuki Handa ,  Yoshihisa Yamashita ,  Seiichi Nakatani

    IPC分类号： H01G9/00

    CPC分类号： H01G9/012 ,  H01G4/26 ,  H05K1/186 ,  H05K3/321 ,  H05K3/4614 ,  Y10T29/417

    摘要： A miniature solid electrolytic capacitor is provided, which is suitable for being disposed within an electrically insulating layer, and is connected to other component using an electrically conductive adhesive with a connection resistance at an anode low and with connection reliability improved. Specifically, the electrolytic capacitor includes a valve metal element for an anode 10 having a capacitor forming part 10A and an electrode lead part 10B, a dielectric oxide film 11 formed on the valve element, a solid electrolyte layer 12 formed on the dielectric oxide film 11 and a charge collecting element for a cathode 13 formed on the solid electrolyte layer 12, wherein at least one through hole 15 is formed in the electrode lead part 10B so as to expose a core 10C of the valve metal element, and an exposed portion 10D of the core is used for connecting portion.

    摘要翻译： 提供一种微型固体电解电容器，其适于布置在电绝缘层内，并且使用具有阳极连接电阻的导电粘合剂连接到其它部件，并提高连接可靠性。 具体地，电解电容器包括：具有电容器形成部10A的阳极10的阀金属元件和电极引线部10B，形成在阀元件上的电介质氧化膜11，形成在电介质氧化物上的固体电解质层12 膜11和形成在固体电解质层12上的用于阴极13的电荷收集元件，其中至少一个通孔15形成在电极引线部分10B中，以暴露阀金属元件的芯部10 C，以及 芯的露出部分10D用于连接部分。

    Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same
    9.
    发明授权
    Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same 有权
    电容器及其制造方法以及具有内置电容器的电路板及其制造方法

    公开(公告)号：US07126811B2

    公开(公告)日：2006-10-24

    申请号：US10726675

    申请日：2003-12-04

    申请人： Koichi Hirano ,  Tsunenori Yoshida ,  Hiroyuki Handa ,  Yoshihisa Yamashita ,  Seiichi Nakatani

    发明人： Koichi Hirano ,  Tsunenori Yoshida ,  Hiroyuki Handa ,  Yoshihisa Yamashita ,  Seiichi Nakatani

    IPC分类号： H01G9/00

    CPC分类号： H01G9/012 ,  H01G4/26 ,  H05K1/186 ,  H05K3/321 ,  H05K3/4614 ,  Y10T29/417

    摘要： A miniature solid electrolytic capacitor is provided, which is suitable for being disposed within an electrically insulating layer, and is connected to a component using an electrically conductive adhesive with a connection resistance at an anode being low and with connection reliability being improved. Specifically, the electrolytic capacitor includes a valve metal element for an anode having a capacitor forming part and an electrode lead part, a dielectric oxide film formed on the valve element, a solid electrolyte layer formed on the dielectric oxide film and a charge collecting element for a cathode formed on the solid electrolyte layer, wherein at least one through hole is formed in the electrode lead part so as to expose a core of the valve metal element, and wherein an exposed portion of the core is used as a connecting portion.

    摘要翻译： 提供了一种微型固体电解电容器，其适用于设置在电绝缘层中，并且使用导电粘合剂连接到组件，其中阳极处的连接电阻低，并且连接可靠性得到改善。 具体地说，电解电容器包括用于阳极的阀金属元件，具有电容器形成部分和电极引线部分，形成在阀元件上的电介质氧化膜，形成在电介质氧化物膜上的固体电解质层和用于 形成在所述固体电解质层上的阴极，其中，在所述电极引线部中形成有至少一个通孔，以露出所述阀金属元件的芯，并且其中所述芯的暴露部分用作连接部。

    Module with built-in circuit elements
    10.
    发明申请
    Module with built-in circuit elements 审中-公开
    模块内置电路元件

    公开(公告)号：US20070035013A1

    公开(公告)日：2007-02-15

    申请号：US10555097

    申请日：2004-05-07

    申请人： Hiroyuki Handa ,  Seiichi Nakatani ,  Koichi Hirano ,  Osamu Inoue ,  Akihiro Ishikawa ,  Tsunenori Yoshida

    发明人： Hiroyuki Handa ,  Seiichi Nakatani ,  Koichi Hirano ,  Osamu Inoue ,  Akihiro Ishikawa ,  Tsunenori Yoshida

    IPC分类号： H01L23/34

    CPC分类号： H01L25/16 ,  H01L23/5389 ,  H01L2224/73204 ,  H01L2924/16152 ,  H01L2924/19105 ,  H05K1/0204 ,  H05K1/185 ,  H05K3/4614 ,  H05K2201/0209 ,  H05K2201/10416

    摘要： In a module including circuit elements, a plurality of wires, which are generally two-dimensionally formed, are multi-layered via electrically insulating material, which comprises a mixture including at least filler and electrically insulating resin. One or more circuit elements are electrically connected to the wires, and at least a part of those circuit elements is embedded in the electrically insulating material. The module further includes a heat sink member that has a higher thermal conductivity than the electrically insulating material, and that, when viewed from the direction of multi-layering the wires, overlaps with a circuit element, which is one of those circuit elements, exhibiting the highest temperature rise at least in the module.

    摘要翻译： 在包括电路元件的模块中，通常通过二维形成的多根电线通过电绝缘材料是多层的，其包括至少包括填料和电绝缘树脂的混合物。 一个或多个电路元件电连接到导线，并且这些电路元件的至少一部分嵌入电绝缘材料中。 该模块还包括具有比电绝缘材料更高的热导率的散热构件，并且当从多层的方向观察时，导线与作为那些电路元件之一的电路元件重叠， 模块中至少有最高的升温。