Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US10852180Application Date: 2004-05-25
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Publication No.: US07042014B2Publication Date: 2006-05-09
- Inventor: Atsushi Sugitatsu , Hitoshi Tada , Susumu Noda
- Applicant: Atsushi Sugitatsu , Hitoshi Tada , Susumu Noda
- Applicant Address: JP Tokyo JP Kyoto
- Assignee: Mitsubishi Denki Kabushiki Kaisha,Kyoto University
- Current Assignee: Mitsubishi Denki Kabushiki Kaisha,Kyoto University
- Current Assignee Address: JP Tokyo JP Kyoto
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: JP2003-279857 20030725
- Main IPC: H01L27/15
- IPC: H01L27/15

Abstract:
A semiconductor device has a two-dimensional slab photonic crystal structure in which a substrate supports a sheet-like slab layer including, sequentially stacked, a lower cladding layer, an active layer, and an upper cladding layer. A periodic refractive index profile structure, in surfaces of the stacked layers, introduces a linear defect region that serves as a waveguide. A p-type region and an n-type region in the slab layer define a pn junction surface at a predetermined angle with respect to the surfaces of the stacked layers in the slab layer.
Public/Granted literature
- US20050029536A1 Semiconductor device and method of manufacturing semiconductor device Public/Granted day:2005-02-10
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