Invention Grant
- Patent Title: Transmission line with integrated connection pads for circuit elements
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Application No.: US10393164Application Date: 2003-03-19
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Publication No.: US07042067B2Publication Date: 2006-05-09
- Inventor: Giorgio Giaretta , Rudolf J. Hofmeister , The′ Linh Nguyen , Dev Kumar
- Applicant: Giorgio Giaretta , Rudolf J. Hofmeister , The′ Linh Nguyen , Dev Kumar
- Applicant Address: US CA Sunnyvale
- Assignee: Finisar Corporation
- Current Assignee: Finisar Corporation
- Current Assignee Address: US CA Sunnyvale
- Agency: Workman Nydegger
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L23/48

Abstract:
An optoelectronic assembly includes a circuit board having a set of signal traces, where one or more of the signal traces has a junction point that integrates a pad of a circuit element. Exemplary circuit elements include a resistor, capacitor, and an inductor. The junction point has a first width and a first thickness, and the one or more signal traces have a second width and a second thickness. The dimensions of the junction point and the dimensions of the one or more signal traces are configured such that the first width and the second width are substantially similar, and that the first thickness and the second thickness are substantially similar. In one embodiment, the first width is no greater than 125% of the second width.
Public/Granted literature
- US20030179558A1 Transmission line with integrated connection pads for circuit elements Public/Granted day:2003-09-25
Information query
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