发明授权
US07042095B2 Semiconductor device including an interconnect having copper as a main component
有权
包括具有铜作为主要成分的互连的半导体装置
- 专利标题： Semiconductor device including an interconnect having copper as a main component
- 专利标题（中）： 包括具有铜作为主要成分的互连的半导体装置
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申请号： US10387504申请日： 2003-03-14
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公开(公告)号： US07042095B2公开(公告)日： 2006-05-09
- 发明人: Junji Noguchi , Tsuyoshi Fujiwara
- 申请人： Junji Noguchi , Tsuyoshi Fujiwara
- 申请人地址： JP Tokyo
- 专利权人： Renesas Technology Corp.
- 当前专利权人： Renesas Technology Corp.
- 当前专利权人地址： JP Tokyo
- 代理机构： Antonelli, Terry, Stout and Kraus, LLP.
- 优先权： JP2002-094351 20020329; JP2002-361363 20021212
- 主分类号： H01L21/88
- IPC分类号： H01L21/88 ; H01L23/48
摘要：
Provided are a semiconductor device comprising a semiconductor substrate, a first insulating film formed thereover, interconnects formed over the first insulating film and having copper as a main component, a second insulating film formed over the upper surface and side surfaces of each of the interconnects and over the first insulating film and having a function of suppressing or preventing copper diffusion, and a third insulating film formed over the second insulating film and having a dielectric constant lower than that of the second insulating film; and a method of manufacturing the semiconductor device. This invention makes it possible to improve dielectric breakdown strength between copper interconnects and reduce capacitance between the copper interconnects.
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