发明授权
- 专利标题: Semiconductor structure having a strained region and a method of fabricating same
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申请号: US10657616申请日: 2003-09-08
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公开(公告)号: US07045836B2公开(公告)日: 2006-05-16
- 发明人: Wen-Chin Lee , Chung-Hu Ge , Chenming Hu
- 申请人: Wen-Chin Lee , Chung-Hu Ge , Chenming Hu
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Slater & Matsil, L.L.P.
- 主分类号: H01L21/00
- IPC分类号: H01L21/00
摘要:
A semiconductor structure including a highly strained selective epitaxial top layer suitable for use in fabricating a strained channel transistor. The top layer is deposited on the uppermost of a series of one or more lower layers. The lattice of each layer is mismatched with the lattice of its subjacent layer by an amount not less than the lattice mismatch between the lowest layer of the series and a substrate on which it resides. A trench is formed in the uppermost series layer. The trench has rounded corners so that a dielectric material filling the trench conforms to the round corners. The rounded corners are produced by heating the uppermost series layer after trench formation.
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