发明授权
US07045900B2 Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device
有权
半导体芯片及其制造方法以及具有半导体芯片的半导体器件与固态器件接合
- 专利标题： Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device
- 专利标题（中）： 半导体芯片及其制造方法以及具有半导体芯片的半导体器件与固态器件接合
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申请号： US10797018申请日： 2004-03-11
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公开(公告)号： US07045900B2公开(公告)日： 2006-05-16
- 发明人: Junichi Hikita , Goro Nakatani , Nobuhisa Kumamoto , Katsumi Sameshima , Kazutaka Shibata , Shigeyuki Ueda
- 申请人： Junichi Hikita , Goro Nakatani , Nobuhisa Kumamoto , Katsumi Sameshima , Kazutaka Shibata , Shigeyuki Ueda
- 申请人地址： JP Kyoto
- 专利权人： Rohm Co., LTD
- 当前专利权人： Rohm Co., LTD
- 当前专利权人地址： JP Kyoto
- 代理机构： Rabin & Berdo, P.C.
- 优先权： JP11-029842 19990208; JP11-033116 19990210; JP11-040400 19990218; JP11-051212 19990226; JP11-265739 19990920
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52
摘要：
A semiconductor chip having a functional bump provided on a surface of a semiconductor substrate thereof for electrical connection between an internal circuit thereof and a solid device, and a dummy bump not serving for the electrical connection between the internal circuit and the solid device. The dummy bump may be a stress relieving bump for relieving stresses exerted thereon. The dummy bump may be connected to a low impedance portion. The functional bump and the dummy bump may be provided on a surface protective film. In this case, the dummy bump is provided on a recess formed in the surface protective film.
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