Invention Grant
- Patent Title: Method of manufacturing a semiconductor device
- Patent Title (中): 制造半导体器件的方法
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Application No.: US10976680Application Date: 2004-10-28
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Publication No.: US07049197B2Publication Date: 2006-05-23
- Inventor: Woo-Soon Jang , Joon Kim , Eun-Kuk Chung
- Applicant: Woo-Soon Jang , Joon Kim , Eun-Kuk Chung
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Marger Johnson & McCollom, P.C.
- Priority: KR10-2003-0076570 20031031
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
In a method of manufacturing a semiconductor device including independent gate patterns separated from each other, an active region is defined by forming a field region on a substrate. A gate oxide layer and a polysilicon layer are formed on the substrate. A preliminary gate pattern is formed by partially removing the polysilicon layer along a first direction by a first etching process. A spacer is formed along a side surface of the preliminary gate pattern. A number of separated gate patterns is formed by partially removing the preliminary gate pattern along a second direction crossing the first direction by a second etching process. The gate patterns overlap with the active regions and are separated from each other. Therefore, the overlap margin is increased, and the polysilicon layer is prevented from being over-etched when it is patterned to form the gate pattern.
Public/Granted literature
- US20050164455A1 Method of manufacturing a semiconductor device Public/Granted day:2005-07-28
Information query
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