- 专利标题： Paste including a mixture of powders, connection plug, burying method, and semiconductor device manufacturing method
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申请号： US10646703申请日： 2003-08-25
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公开(公告)号： US07049223B2公开(公告)日： 2006-05-23
- 发明人: Keiichi Sasaki , Manabu Kimura , Yoshimi Hisatsune , Nobuo Hayasaka
- 申请人： Keiichi Sasaki , Manabu Kimura , Yoshimi Hisatsune , Nobuo Hayasaka
- 申请人地址： JP Kawasaki
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JP Kawasaki
- 代理机构： Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- 优先权： JP10-151800 19980601; JP10-258830 19980911
- 主分类号： H01L21/4763
- IPC分类号： H01L21/4763 ; H01L21/44
摘要：
Form a trench in a major surface of a semiconductor substrate, then bury a paste in the trench. The paste contains solids having a conductive substance and a resin, and solvent for dissolving the resin. The solids content of the paste is not less than 60 vol % and a viscosity ratio thereof is not more than 2.
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