发明授权
US07055535B2 Holding unit, processing apparatus and holding method of substrates
失效
保持单元，加工设备和基板的保持方法
- 专利标题： Holding unit, processing apparatus and holding method of substrates
- 专利标题（中）： 保持单元，加工设备和基板的保持方法
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申请号： US10629678申请日： 2003-07-30
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公开(公告)号： US07055535B2公开(公告)日： 2006-06-06
- 发明人: Junji Kunisawa , Norio Kimura , Kenya Ito , Akira Fukunaga , Yuuki Inoue , Hiroshi Tomita , Soichi Nadahara , Motoyuki Sato
- 申请人： Junji Kunisawa , Norio Kimura , Kenya Ito , Akira Fukunaga , Yuuki Inoue , Hiroshi Tomita , Soichi Nadahara , Motoyuki Sato
- 申请人地址： JP Tokyo
- 专利权人： Ebara Corporation
- 当前专利权人： Ebara Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 优先权： JP2000-332163 20001031; JP2001-114947 20010413
- 主分类号： B08B3/08
- IPC分类号： B08B3/08 ; B25B11/00 ; H01L21/306
摘要：
A holding unit holds a substrate to enable a surface of the substrate to be processed. The unit has a vacuum suction member that comes into contact with a peripheral portion of the surface of the substrate and sucks the substrate. A processing apparatus holds the wafer stably and allows an edge, a bevel portion and/or a back surface of the wafer to be processed.
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