公开(公告)号：US07055535B2

公开(公告)日：2006-06-06

申请号：US10629678

申请日：2003-07-30

申请人： Junji Kunisawa ,  Norio Kimura ,  Kenya Ito ,  Akira Fukunaga ,  Yuuki Inoue ,  Hiroshi Tomita ,  Soichi Nadahara ,  Motoyuki Sato

发明人： Junji Kunisawa ,  Norio Kimura ,  Kenya Ito ,  Akira Fukunaga ,  Yuuki Inoue ,  Hiroshi Tomita ,  Soichi Nadahara ,  Motoyuki Sato

IPC分类号： B08B3/08 ,  B25B11/00 ,  H01L21/306

CPC分类号： H01L21/6838 ,  Y10S134/902 ,  Y10T279/11

摘要： A holding unit holds a substrate to enable a surface of the substrate to be processed. The unit has a vacuum suction member that comes into contact with a peripheral portion of the surface of the substrate and sucks the substrate. A processing apparatus holds the wafer stably and allows an edge, a bevel portion and/or a back surface of the wafer to be processed.

摘要翻译： 保持单元保持基板以使得能够处理基板的表面。 该单元具有与基板的表面的周边部分接触并吸附基板的真空吸附构件。 处理装置稳定地保持晶片，并且允许晶片的边缘，斜面部分和/或背面被处理。

公开(公告)号：US06679950B2

公开(公告)日：2004-01-20

申请号：US09892742

申请日：2001-06-28

申请人： Hiroshi Tomita ,  Motoyuki Sato ,  Soichi Nadahara ,  Mitsuhiko Shirakashi ,  Kenya Ito

发明人： Hiroshi Tomita ,  Motoyuki Sato ,  Soichi Nadahara ,  Mitsuhiko Shirakashi ,  Kenya Ito

IPC分类号： B08B300

CPC分类号： H01L21/67046 ,  B01F3/04099 ,  B01F3/0446 ,  B01F5/0476 ,  B01F2003/0439 ,  B01F2003/04886 ,  B01F2201/01 ,  B08B1/00 ,  B08B1/04 ,  B08B3/02 ,  Y10S134/902

摘要： A substrate cleaning method of the present invention enables effective cleaning of a wafer having a recess therein without causing any increase in cleaning costs. Ozone gas and ammonia water are supplied to an area right above a wafer 7 having a recess therein, and a gas-dissolving liquid is produced by dissolving the ozone gas in the ammonia water. The gas-dissolving liquid is used to carry out contact and non-contact types of physical cleaning on the wafer.

摘要翻译： 本发明的基板清洗方法能够有效地清洗其中具有凹槽的晶片，而不会导致清洁成本的任何增加。 将臭氧气体和氨水供给到其中具有凹部的晶片7的正上方的区域，并且通过将臭氧气体溶解在氨水中来制造气体溶解液。 气溶液用于在晶片上进行接触和非接触式的物理清洁。

公开(公告)号：US06543080B1

公开(公告)日：2003-04-08

申请号：US09635848

申请日：2000-08-11

申请人： Hiroshi Tomita ,  Soichi Nadahara ,  Mitsuhiko Shirakashi ,  Kenya Ito ,  Yuki Inoue

发明人： Hiroshi Tomita ,  Soichi Nadahara ,  Mitsuhiko Shirakashi ,  Kenya Ito ,  Yuki Inoue

IPC分类号： B08B312

CPC分类号： B08B3/12

摘要： A semiconductor substrate cleaning apparatus and method are capable of efficiently removing contamination from both the obverse and reverse sides of a semiconductor substrate. A single cleaning liquid supply nozzle for supplying a cleaning liquid to both the obverse and reverse sides of a semiconductor substrate to be cleaned is placed at a distance from the outer peripheral edge of the substrate. An ultrasonic vibrator applies ultrasonic waves to both the obverse and reverse sides of the substrate. Four driving rollers are disposed in contact with the outer peripheral edge of the substrate. The driving rollers are adapte to rotate while being engaged with the outer peripheral edge of the substrate thereby drivingly rotating the substrate.

摘要翻译： 半导体衬底清洁装置和方法能够有效地去除半导体衬底的正面和反面两侧的污染物。 将待清洗的半导体衬底的正面和反面两侧的清洗液供给单个清洗液供给喷嘴设置在与衬底的外周边缘一定距离处。 超声波振动器对基板的正反面施加超声波。 四个驱动辊设置成与基板的外周边缘接触。 驱动辊适于旋转，同时与基板的外周边缘接合，从而驱动旋转基板。

公开(公告)号：US08393935B2

公开(公告)日：2013-03-12

申请号：US12673294

申请日：2008-07-23

申请人： Norio Kimura ,  Kenya Ito ,  Tamami Takahashi ,  Masaya Seki

发明人： Norio Kimura ,  Kenya Ito ,  Tamami Takahashi ,  Masaya Seki

IPC分类号： B24B9/00 ,  B24B21/00

CPC分类号： B24B9/065

摘要： A polishing apparatus polishes a periphery (a bevel portion, a notch portion, an edge-cut portion) of a substrate by bringing a polishing tool into sliding contact with the periphery of the substrate. The polishing apparatus includes a substrate holder configured to hold the substrate, and a polishing head configured to polish the periphery of the substrate held by the substrate holder using the polishing tool. The polishing head includes a press pad for pressing the polishing tool against the periphery of the substrate, and a linear motor configured to reciprocate the press pad.

摘要翻译： 抛光装置通过使抛光工具与基板的周边滑动接触来抛光基板的周边（斜面部分，切口部分，边缘切割部分）。 抛光装置包括：被配置为保持基板的基板保持器，以及抛光头，其被构造成使用抛光工具抛光由基板保持器保持的基板的周边。 抛光头包括用于将抛光工具压靠在基板的周边上的压垫，以及配置成使压垫往复运动的线性电动机。

公开(公告)号：US20110165825A1

公开(公告)日：2011-07-07

申请号：US12673294

申请日：2008-07-23

申请人： Norio Kimura ,  Kenya Ito ,  Tamami Takahashi ,  Masaya Seki

发明人： Norio Kimura ,  Kenya Ito ,  Tamami Takahashi ,  Masaya Seki

IPC分类号： B24B9/00

CPC分类号： B24B9/065

摘要： A polishing apparatus according to the present invention is a polishing apparatus for polishing a periphery (a bevel portion, a notch portion, an edge-cut portion) of a substrate (W) by bringing a polishing tool (41) into sliding contact with the periphery of the substrate. The polishing apparatus includes a substrate holder (20) configured to hold the substrate (W); and a polishing head (42) configured to polish the periphery of the substrate (W) held by the substrate holder (20) using the polishing tool (41). The polishing head (42) includes a press pad (50) for pressing the polishing tool (41) against the periphery of the substrate (W), and a linear motor (90) configured to reciprocate the press pad (50).

摘要翻译： 根据本发明的研磨装置是通过使研磨工具（41）与所述基板（W）滑动接触来研磨基板（W）的周边（斜面部，切口部，边缘切断部）的研磨装置 衬底周边。 抛光装置包括：基板保持架（20），其构造成保持基板（W）; 以及抛光头（42），其被配置为使用所述抛光工具（41）抛光由所述基板保持器（20）保持的所述基板（W）的周边。 抛光头（42）包括用于将抛光工具（41）压靠在基板（W）的周边上的压垫（50）和构造成使压垫（50）往复运动的直线电动机（90）。

公开(公告)号：US09199352B2

公开(公告)日：2015-12-01

申请号：US12986481

申请日：2011-01-07

申请人： Masaya Seki ,  Kenya Ito ,  Masayuki Nakanishi

发明人： Masaya Seki ,  Kenya Ito ,  Masayuki Nakanishi

IPC分类号： B24B9/00 ,  B24B9/06 ,  B24B21/00 ,  B24B37/27

CPC分类号： B24B9/065 ,  B24B21/004 ,  B24B37/27

摘要： A polishing apparatus polishes a top edge portion and/or a bottom edge portion of a substrate accurately and uniformly. The polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and to rotate the substrate and at least one polishing head disposed near the peripheral portion of the substrate. The polishing head has at least one protrusion extending along a circumferential direction of the substrate, and the polishing head is configured to press a polishing surface of a polishing tape by the protrusion against the peripheral portion of the substrate from above or below.

摘要翻译： 抛光装置精确而均匀地抛光基板的顶边部分和/或底边部分。 抛光装置包括旋转保持机构，其构造成水平地保持基板并旋转基板和设置在基板的周边部分附近的至少一个抛光头。 抛光头具有沿着基板周向延伸的至少一个突出部，并且抛光头构造成通过突起抵靠基板的周边部分从上方或下方按压抛光带的抛光表面。

公开(公告)号：US08840992B2

公开(公告)日：2014-09-23

申请号：US12908187

申请日：2010-10-20

申请人： Hiroyuki Iizuka ,  Kenya Ito ,  Koji Ohguma ,  Mikio Yamahiro

发明人： Hiroyuki Iizuka ,  Kenya Ito ,  Koji Ohguma ,  Mikio Yamahiro

IPC分类号： G11B5/708 ,  C09D133/08 ,  B32B5/16

CPC分类号： B32B5/16 ,  C09D133/08 ,  Y10T428/25 ,  Y10T428/257 ,  Y10T428/265

摘要： The curable resin composition of the present invention contains inorganic particles and a curable resin. The inorganic particles includes an inorganic particle (a-1) having a Mohs hardness of 7 or more and an average particle diameter of 1 μm or less, an inorganic particle (a-2) having a Mohs hardness of 4 or more to less than 7 and an average particle diameter of 1 μm or less, and an inorganic particle (a-3) having a Mohs hardness of less than 4 and an average particle diameter of 1 μm or less. The curable resin is at least one selected from a group consisting of a thermosetting resin and an active energy ray-curable resin.

摘要翻译： 本发明的固化性树脂组合物含有无机粒子和固化性树脂。 无机粒子包括莫氏硬度为7以上，平均粒径为1μm以下的无机粒子（a-1），莫氏硬度为4以上的无机粒子（a-2） 7，平均粒径为1μm以下，以及莫氏硬度小于4，平均粒径为1μm以下的无机粒子（a-3）。 可固化树脂是选自热固性树脂和活性能量射线固化树脂中的至少一种。

公开(公告)号：US20140113115A1

公开(公告)日：2014-04-24

申请号：US14127964

申请日：2012-06-18

申请人： Kenya Ito ,  Koji Ohguma ,  Takuro Tanaka ,  Yuka Takahashi ,  Aki Kuromatsu ,  Mikio Yamahiro

发明人： Kenya Ito ,  Koji Ohguma ,  Takuro Tanaka ,  Yuka Takahashi ,  Aki Kuromatsu ,  Mikio Yamahiro

IPC分类号： B29C45/14 ,  B32B38/00

CPC分类号： B29C45/14688 ,  B29C45/14 ,  B29C45/14811 ,  B29C45/14827 ,  B32B7/06 ,  B32B27/16 ,  B32B38/0036 ,  B32B2270/00 ,  B32B2451/00 ,  B44C1/1729 ,  Y10T428/24851 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31551 ,  Y10T428/31554 ,  Y10T428/31598 ,  Y10T428/31663 ,  Y10T428/31946

摘要： Provided is a transfer film for in-mold molding which is superior in solvent resistance, heat resistance, durability, blocking resistance, and moldability, and is capable of suppressing the generation of gate flow, and also provided is a method for producing such a film. The film is provided with: a transfer layer (11) which is to be transferred to an in-mold molded body and which is to be cured when irradiated with active energy rays after the transfer; and a film shaped substrate (L0). The transfer layer (11) comprises an IMD layer (L2) laminated on the substrate (L0) and to be arranged on the outermost surface of the molded body after the in-mold molding. The TMD layer (L2) is constituted by a mixture composition containing at least one active-energy curable resin and at least one thermosetting resin.

摘要翻译： 提供了一种模内成型用转印膜，其耐溶剂性，耐热性，耐久性，耐粘连性和成型性优异，并且能够抑制栅极流动的产生，并且还提供了制造这种膜的方法 。 膜设置有：转印层（11），其被转印到模内成型体中，并且在转印后用活性能量射线照射时被固化; 和薄膜状基板（L0）。 转印层（11）包括层叠在基板（L0）上的IMD层（L2），并且在模内成型之后布置在成形体的最外表面上。 TMD层（L2）由含有至少一种活性能固化树脂和至少一种热固性树脂的混合物组合物构成。

公开(公告)号：US08641480B2

公开(公告)日：2014-02-04

申请号：US13036114

申请日：2011-02-28

申请人： Masayuki Nakanishi ,  Tetsuji Togawa ,  Kenya Ito ,  Masaya Seki ,  Kenji Iwade ,  Takeo Kubota ,  Takeshi Nishioka

发明人： Masayuki Nakanishi ,  Tetsuji Togawa ,  Kenya Ito ,  Masaya Seki ,  Kenji Iwade ,  Takeo Kubota ,  Takeshi Nishioka

IPC分类号： B24B1/00

CPC分类号： B24B1/00 ,  B24B55/00

摘要： A polishing apparatus can effectively prevent abrasive particles from falling off a polishing tape during polishing. The polishing apparatus includes: a polishing head for polishing a peripheral portion of a substrate by pressing a surface of a polishing tape, having abrasive particles fixed on the surface, against the peripheral portion of the substrate while allowing the polishing tape to travel in one direction; and a conditioning apparatus, disposed upstream of the polishing head in the traveling direction of the polishing tape, for conditioning the surface of the polishing tape in advance in order to prevent the abrasive particles from falling off the surface of the polishing tape during polishing.

摘要翻译： 抛光装置可以有效地防止研磨颗粒在抛光过程中从抛光带上脱落。 抛光装置包括：抛光头，用于通过将具有固定在表面上的研磨颗粒的研磨带的表面按压在基板的周边部分上，同时允许研磨带沿单向移动来抛光基板的周边部分 ; 以及调整装置，其设置在研磨带的行进方向上的抛光头的上游，用于预先调整研磨带的表面，以防止研磨颗粒在抛光期间从研磨带的表面脱落。

公开(公告)号：US08506362B2

公开(公告)日：2013-08-13

申请号：US12667891

申请日：2008-07-08

申请人： Dai Fukushima ,  Atsushi Shigeta ,  Tamami Takahashi ,  Kenya Ito ,  Masaya Seki ,  Hiroaki Kusa

发明人： Dai Fukushima ,  Atsushi Shigeta ,  Tamami Takahashi ,  Kenya Ito ,  Masaya Seki ,  Hiroaki Kusa

IPC分类号： B24B7/26

CPC分类号： B24B21/002 ,  B24B9/065 ,  H01L21/02021

摘要： A polishing apparatus includes a substrate holder configured to hold and rotate a substrate, a press pad configured to press a polishing tape having a polishing surface against a bevel portion of the substrate held by the substrate holder, and a feeding mechanism configured to cause the polishing tape to travel in its longitudinal direction. The press pad includes a hard member having a pressing surface for pressing the bevel portion of the substrate through the polishing tape, and at least one elastic member for pressing the hard member against the bevel portion of the substrate through the belt-shaped polishing tool.

摘要翻译： 抛光装置包括：基板保持器，其构造成保持和旋转基板;压垫，其构造成将具有抛光表面的抛光带压靠在由基板保持器保持的基板的斜面部分上;以及馈送机构，其构造成使抛光 胶带沿其纵向行进。 压垫包括具有用于通过研磨带挤压基板的斜面部分的按压表面的硬质部件和用于通过带状抛光工具将硬质部件压靠在基板的斜面部分上的至少一个弹性部件。