发明授权
- 专利标题： Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material
- 专利标题（中）： 树脂封装方法，树脂封装装置，半导体器件制造方法，半导体器件和树脂材料
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申请号： US10719379申请日： 2003-11-20
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公开(公告)号： US07056770B2公开(公告)日： 2006-06-06
- 发明人: Hiroshi Uragami , Osamu Nakagawa , Kinya Fujino , Shinji Takase , Hideki Tokuyama , Koichi Meguro , Toru Nishino , Noboru Hayasaka
- 申请人： Hiroshi Uragami , Osamu Nakagawa , Kinya Fujino , Shinji Takase , Hideki Tokuyama , Koichi Meguro , Toru Nishino , Noboru Hayasaka
- 申请人地址： JP Kyoto JP Kawasaki
- 专利权人： Towa Corporation,Fujitsu Limited
- 当前专利权人： Towa Corporation,Fujitsu Limited
- 当前专利权人地址： JP Kyoto JP Kawasaki
- 代理商 W. F. Fasse; W. G. Fasse
- 优先权： JP2002-341965 20021126
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
First, a board is placed on a board mounting portion with a lower mold and an upper mold being opened. Then, a resin material having such size and shape that correspond to the size and shape of a cavity formed in the lower mold is fitted in the cavity. Thereafter, the resin material is heated resulting in melted resin. Thereafter, the lower mold and the upper mold are closed, with a space formed by the upper mold and the lower mold being reduced in pressure. As a result, chips and wires are immersed in the melted resin. Thereafter, the melted resin is set, so that a resin mold product including the board and the set resin is formed.
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