发明授权
- 专利标题： Bond pad
- 专利标题（中）： 债券垫
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申请号： US10707089申请日： 2003-11-20
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公开(公告)号： US07056820B2公开(公告)日： 2006-06-06
- 发明人: Stephen P. Cole , William J. Murphy , Barbara A. Waterhouse
- 申请人： Stephen P. Cole , William J. Murphy , Barbara A. Waterhouse
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Schmeiser, Olsen & Watts
- 代理商 William D. Sabo
- 主分类号： H01L21/4763
- IPC分类号： H01L21/4763
摘要：
A bond pad upon which a wirebond interconnection is formed, consisting of a first bond pad layer formed on a chip, and a second bond pad layer formed on the first bond pad layer, wherein the first bond pad layer is more resistant to removal than the second bond pad layer during probe testing, and the first bond pad layer increases resistance to interconnection failure during mechanical testing.
公开/授权文献
- US20050112794A1 IMPROVED BOND PAD 公开/授权日：2005-05-26
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