发明授权
- 专利标题: Apparatus for holding and mounting a component
- 专利标题(中): 用于保持和安装部件的装置
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申请号: US11109739申请日: 2005-04-20
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公开(公告)号: US07059036B2公开(公告)日: 2006-06-13
- 发明人: Osamu Okuda , Yoshihiro Yoshida , Akira Kabeshita , Satoshi Shida , Naoyuki Kitamura
- 申请人: Osamu Okuda , Yoshihiro Yoshida , Akira Kabeshita , Satoshi Shida , Naoyuki Kitamura
- 申请人地址: JP Osaka-fu
- 专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址: JP Osaka-fu
- 代理机构: Wenderoth, Lind & Ponack, L.L.P.
- 优先权: JP9-259708 19970925; JP9-307407 19971110
- 主分类号: H05K13/04
- IPC分类号: H05K13/04
摘要:
An electronic component mounting apparatus which employs a first air feed device connected to an air passage at one end part of a spline shaft, and a second air feed device connected to the air passage in the vicinity of the other end of the spline shaft. The first and second air feeds function to supply air to the air passage to return an interior thereof to atmospheric pressure. The time required to return the vacuum pressure in the air passage to atmospheric pressure can be shortened by the use of the two separate air feeds.
公开/授权文献
- US20050183263A1 Apparatus for holding and mounting a component 公开/授权日:2005-08-25
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