Invention Grant
- Patent Title: Open socket
- Patent Title (中): 打开插座
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Application No.: US10868976Application Date: 2004-06-17
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Publication No.: US07061768B2Publication Date: 2006-06-13
- Inventor: Dong-Chun Lee , Byung-Man Kim , Kwang-Su Yu , Dong-Woo Shin , Young-Soo Lee
- Applicant: Dong-Chun Lee , Byung-Man Kim , Kwang-Su Yu , Dong-Woo Shin , Young-Soo Lee
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2003-0085818 20031128
- Main IPC: H05K5/03
- IPC: H05K5/03

Abstract:
An open socket, into which a module can be inserted, may include: a body into which the module is insertable; a pin to contact an electrical connection member of the inserted module, the pin serving as at least a part of an electrical signal path to/from the module upon insertion thereof; an elastic biasing member to exert an elastic biasing force to cause the pin to contact the module; and at least one lower support to limit insertion depth as being a depth at which a lower portion of the inserted module comes to rest upon the at least one lower support; the body and the at least one lower support being constructed and arranged to provide a gap adjacent the at least one support, which leaves an area of the socket underlying the lower portion of the inserted module open to the outside.
Public/Granted literature
- US20050118878A1 Open socket Public/Granted day:2005-06-02
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