发明授权
- 专利标题： Semiconductor device having a ball grid array and a fabrication process thereof
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申请号： US10893297申请日： 2004-07-19
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公开(公告)号： US07064047B2公开(公告)日： 2006-06-20
- 发明人: Norio Fukasawa , Hirohisa Matsuki , Kenichi Nagashige , Yuzo Hamanaka , Muneharu Morioka
- 申请人： Norio Fukasawa , Hirohisa Matsuki , Kenichi Nagashige , Yuzo Hamanaka , Muneharu Morioka
- 申请人地址： JP Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JP Kawasaki
- 代理机构： Westerman, Hattori, Daniels & Adrian, L.L.P.
- 优先权： JP10-048082 19980227
- 主分类号： H01L23/04
- IPC分类号： H01L23/04
摘要：
A semiconductor device has a resin package layer on a principal surface of a semiconductor chip, on which a number of bump electrodes are formed, wherein the semiconductor device has a chamfer surface or a stepped surface on a top edge part such that the external shock or stress applied to such an edge part is dissipated by the chamfer surface of the stepped surface.
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