Invention Grant
- Patent Title: Coating material for electronic components
- Patent Title (中): 电子元器件涂料
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Application No.: US10472772Application Date: 2002-03-28
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Publication No.: US07064176B2Publication Date: 2006-06-20
- Inventor: Marcus Halik , Klaus Lowack , Recai Sezi , Andreas Walter
- Applicant: Marcus Halik , Klaus Lowack , Recai Sezi , Andreas Walter
- Applicant Address: DE Munich
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Munich
- Agency: Fish & Richardson P.C.
- Priority: DE10115882 20010330
- International Application: PCT/EP02/03577 WO 20020328
- International Announcement: WO02/079297 WO 20021010
- Main IPC: C08G73/22
- IPC: C08G73/22 ; C08G69/00
Abstract:
The invention relates to novel polyhydroxyamide compounds that, in the form of their oxazoles, ane suited as a coating material, particularly for electronic components. The invention also relates to a method for producing these novel compounds and to the use thereof.
Public/Granted literature
- US20040138406A1 Coating material for electronic components Public/Granted day:2004-07-15
Information query
