发明授权
- 专利标题: Module for transferring a substrate
- 专利标题(中): 用于转移衬底的模块
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申请号: US10763203申请日: 2004-01-26
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公开(公告)号: US07065898B2公开(公告)日: 2006-06-27
- 发明人: Hyun-Joon Kim , Yo-Han Ahn , Dong-Seok Ham , Jae-Bong Kim
- 申请人: Hyun-Joon Kim , Yo-Han Ahn , Dong-Seok Ham , Jae-Bong Kim
- 申请人地址: KR Suwon
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon
- 代理机构: Lee & Morse, P.C.
- 优先权: KR10-2003-0008847 20030212
- 主分类号: F26B21/06
- IPC分类号: F26B21/06
摘要:
A module for transferring a substrate includes a load port for supporting a container to receive a plurality of substrates, a substrate transfer chamber disposed between the load port and a substrate process module, a substrate transfer robot disposed in the substrate transfer chamber for transferring the substrates between the container and the substrate process module, a gas supply unit connected to the substrate transfer chamber for supplying a purge gas into the substrate transfer chamber to purge an interior of the substrate transfer chamber, and a contamination control unit connected to the substrate transfer chamber for circulating the purge gas supplied into the substrate transfer chamber, resupplying the circulated purge gas into the substrate transfer chamber and removing particles and airborne molecular contaminants from the purge gas being circulated. Contamination of a substrate may be prevented and a necessary amount of purge gas may be reduced.
公开/授权文献
- US20040168742A1 Module for transferring a substrate 公开/授权日:2004-09-02
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