发明授权
- 专利标题: Liquid ejection apparatus
- 专利标题(中): 液体喷射装置
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申请号: US10396991申请日: 2003-03-24
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公开(公告)号: US07066571B2公开(公告)日: 2006-06-27
- 发明人: Takeo Eguchi , Takaaki Miyamoto , Minoru Kohno , Kazuyasu Takenaka , Tatsumi Ito
- 申请人: Takeo Eguchi , Takaaki Miyamoto , Minoru Kohno , Kazuyasu Takenaka , Tatsumi Ito
- 申请人地址: JP Tokyo
- 专利权人: Sony Corporation
- 当前专利权人: Sony Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Trexler, Bushnell, Blackstone, Giangiorgi & Marr
- 代理商 Robert J. Depke
- 优先权: JPP2002-085023 20020326
- 主分类号: B41J2/15
- IPC分类号: B41J2/15 ; B41J2/145
摘要:
In a liquid ejection apparatus including a plurality of chips arranged in a specific direction, each chip including a plurality of liquid ejection units juxtaposed in the specific direction, the displacement of liquid landing position in the specific direction is reduced. A printer head chip includes a heating resistor, which is divided into two and arranged within one ink liquid chamber. The two-divided heating resistors within the one ink liquid chamber are juxtaposed in a direction perpendicular to the lining-up direction of nozzles.
公开/授权文献
- US20040012649A1 Liquid ejection apparatus 公开/授权日:2004-01-22
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