发明授权
- 专利标题： Methods for forming electrically active surfaces for medical electrical leads
- 专利标题（中）： 用于形成医用电线的电活性表面的方法
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申请号： US10923925申请日： 2004-08-23
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公开(公告)号： US07067765B2公开(公告)日： 2006-06-27
- 发明人: Ryan T. Bauer , Daniel R. Pavlik , John L. Sommer
- 申请人： Ryan T. Bauer , Daniel R. Pavlik , John L. Sommer
- 申请人地址： US MN Minneapolis
- 专利权人： Medtronic, Inc.
- 当前专利权人： Medtronic, Inc.
- 当前专利权人地址： US MN Minneapolis
- 代理商 Michael C. Soldner; Girma Wolde-Michael
- 主分类号： B23K26/38
- IPC分类号： B23K26/38
摘要：
A method for forming an electrically active surface for a medical electrical lead includes the steps of inserting a conductor coil into a shroud that includes an opening, lifting an end of at least one filar of a plurality of filars forming the coil out through the opening, and removing a layer of insulation from about the end of the at least one filar by means of laser ablation.
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