发明授权
- 专利标题： Heat spreader and semiconductor device and package using the same
- 专利标题（中）： 散热器和半导体器件和封装使用相同
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申请号： US10701499申请日： 2003-11-06
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公开(公告)号： US07067903B2公开(公告)日： 2006-06-27
- 发明人: Takeshi Tachibana , Kazushi Hayashi , Kenichi Inoue , Yoshihiro Yokota , Koji Kobashi , Nobuyuki Kawakami , Takashi Kobori
- 申请人： Takeshi Tachibana , Kazushi Hayashi , Kenichi Inoue , Yoshihiro Yokota , Koji Kobashi , Nobuyuki Kawakami , Takashi Kobori
- 申请人地址： JP Hyogo
- 专利权人： Kabushiki Kaisha Kobe Seiko Sho
- 当前专利权人： Kabushiki Kaisha Kobe Seiko Sho
- 当前专利权人地址： JP Hyogo
- 代理机构： Reed Smith LLP
- 代理商 Stanley P. Fisher, Esq.; Juan Carlos A. Marquez, Esq.
- 优先权： JP2002-324473 20021107; JP2002-324543 20021107
- 主分类号： H01L29/06
- IPC分类号： H01L29/06 ; H01L23/495 ; H01L23/06 ; H01L23/10
摘要：
A semiconductor device and package has a heat spreader directly disposed on the reverse surface of the semiconductor device. This heat spreader includes a diamond layer or a layer containing diamond and ceramics such as silicon carbide and aluminum nitride. The heat spreader is directly formed on a substrate for the semiconductor device. In particular, the heat spreader is composed of a diamond layer and one or two metal or ceramic members, which are bonded to the diamond layer with one or two polymer adhesive layers. This diamond layer has a fiber structure across the thickness or a microcrystalline structure. Cilia are formed on a surface of the diamond layer facing the one or two metal or ceramic members.
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