Invention Grant
- Patent Title: Management system, management apparatus, management method, and device manufacturing method
- Patent Title (中): 管理体系,管理手段,管理方法和装置制造方法
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Application No.: US10423888Application Date: 2003-04-28
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Publication No.: US07069104B2Publication Date: 2006-06-27
- Inventor: Takehiko Suzuki , Hideki Ina , Koichi Sentoku , Takahiro Matsumoto , Satoru Oishi
- Applicant: Takehiko Suzuki , Hideki Ina , Koichi Sentoku , Takahiro Matsumoto , Satoru Oishi
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2002-129326 20020430
- Main IPC: G06F9/455
- IPC: G06F9/455

Abstract:
A management system including an acquisition device for acquiring actual processing results obtained by operating an industrial device with a set parameter value and another parameter value, and an estimated processing result, an inspection device for inspecting the processing result obtained with the set parameter value, and acquiring and accumulating an inspection result value, a change device for changing the set parameter value on the basis of the processing results acquired by the acquisition device and the inspection result value obtained by the inspection device, an evaluation device for evaluating a variation state of the processing results on the basis of an inspection result value accumulated by the inspection device, and a decision device for deciding, on the basis of an evaluation result by the evaluation device, a frequency at which the acquisition device is executed.
Public/Granted literature
- US20030204348A1 Management system, management apparatus, management method, and device manufacturing method Public/Granted day:2003-10-30
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