Invention Grant
- Patent Title: Polybenzoxazoles from poly-o-hydroxyamide, novel poly-o-hydroxyamides, preparation processes therefor, and their application in microelectronics
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Application No.: US10244802Application Date: 2002-09-16
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Publication No.: US07070904B2Publication Date: 2006-07-04
- Inventor: Recai Sezi
- Applicant: Recai Sezi
- Applicant Address: DE Munich
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Munich
- Agent Laurence A. Greenberg; Werner H. Stemer; Ralph E. Locher
- Priority: DE10145469 20010914
- Main IPC: G03F7/004
- IPC: G03F7/004
Abstract:
High-temperature-stable polybenzoxazoles are formed from novel poly-o-hydroxyamides. The novel poly-o-hydroxyamides have low dielectric constants, are suitable for exposure at 248 nm or shorter wavelengths, and have hydroxyl groups at least some of which have been protected by tert-butoxycarbonyl protective groups.
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