发明授权
- 专利标题: Stacked piezoelectric device and method of fabricating same
- 专利标题(中): 堆叠压电器件及其制造方法
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申请号: US10776335申请日: 2004-02-12
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公开(公告)号: US07073265B2公开(公告)日: 2006-07-11
- 发明人: Takeshi Senoo , Nozomu Okumura , Yasuhiro Suzuki , Isao Mizuno , Akira Fujii
- 申请人: Takeshi Senoo , Nozomu Okumura , Yasuhiro Suzuki , Isao Mizuno , Akira Fujii
- 申请人地址: JP
- 专利权人: Denso Corporation
- 当前专利权人: Denso Corporation
- 当前专利权人地址: JP
- 代理机构: Nixon & Vanderhye PC
- 优先权: JP2003-034173 20030212; JP2004-004476 20040109
- 主分类号: H01L41/08
- IPC分类号: H01L41/08
摘要:
To provide a stacked piezoelectric device which is inexpensive and excellent in bonding strength between a piezoelectric layer and an internal electrode layer, the piezoelectric device comprises piezoelectric layers and internal electrode layers containing not less than 50 percent by weight of Cu stacked alternately. Between the internal electrode layer and the piezoelectric layer, there is a diffusion region formed by mutual diffusion of components of the internal electrode layer and the piezoelectric layer to the other layer and comprising at least one component of the piezoelectric material and Cu. The diffusion region occupies not less than 90 percent of area of interface between the internal electrode layer and the piezoelectric layer, and a thickness of the diffusion region is not more than 10 percent of a thickness of the internal electrode layer. A piezoelectric material constituting the piezoelectric layer preferably comprises PZT which is a Pb(Zr,Ti)O3— based oxide having a perovskite structure, and Pb, Cu, and O elements coexist in the diffusion region.