Invention Grant
- Patent Title: Bump formed on semiconductor device chip and method for manufacturing the bump
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Application No.: US10860536Application Date: 2004-06-02
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Publication No.: US07074704B2Publication Date: 2006-07-11
- Inventor: Yong-hwan Kwon , Sa-yoon Kang
- Applicant: Yong-hwan Kwon , Sa-yoon Kang
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Marger Johnson & McCollom,P.C.
- Priority: KR2002-27440 20020517
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/52
Abstract:
A bump of a semiconductor chip comprises a plurality of bond pads formed on a semiconductor chip, a conductive bump formed on the bond pads; and a sidewall insulating layer formed on sidewalls of the conductive bump. It is possible for the semiconductor chip to prevent electrical shorts and improve productivity even though a pitch of bond pad is decreased.
Public/Granted literature
- US20040219715A1 Bump formed on semiconductor device chip and method for manufacturing the bump Public/Granted day:2004-11-04
Information query
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