Invention Grant
US07077660B2 Land grid array structures and methods for engineering change 失效
土地格栅阵列结构和工程变更方法

Land grid array structures and methods for engineering change
Abstract:
A Land Grid Array structure is enhanced with a flex film interposer that not only provides a Land Grid Array (LGA) electrical connection between a Multi-Chip Module (MCM) and the next level of integration such as a system board, but also provides a reliable means to implement desired Engineering Change (EC) capability as well as a means for decoupling power to ground structure to minimize switching activity effects on the System. The invention as described can be implemented for EC repair, for Capacitive Decoupling or both.
Public/Granted literature
Information query
Patent Agency Ranking
0/0