Invention Grant
- Patent Title: Surface modification of porous metal substrates
- Patent Title (中): 多孔金属基材的表面改性
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Application No.: US10408058Application Date: 2003-04-04
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Publication No.: US07077889B2Publication Date: 2006-07-18
- Inventor: Anand Chellappa , Charles Call , Michael Powell
- Applicant: Anand Chellappa , Charles Call , Michael Powell
- Applicant Address: US CA Long Beach
- Assignee: Intelligent Engery, Inc.
- Current Assignee: Intelligent Engery, Inc.
- Current Assignee Address: US CA Long Beach
- Agency: Greenberg Traurig, LLP
- Agent Mark Krietzman, Esq.
- Main IPC: B01D53/22
- IPC: B01D53/22 ; B01D71/02
Abstract:
A method for reducing the surface variance of a porous metal substrate. The method does not significantly reduce the bulk porosity. The method can be used to reduce the surface pore diameter. A membrane, can be deposited on the reduced variance surface to form a separation membrane.
Public/Granted literature
- US20040194626A1 Surface modification of porous metal substrates Public/Granted day:2004-10-07
Information query
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