Invention Grant
- Patent Title: Schottky barrier diode and method of making the same
- Patent Title (中): 肖特基势垒二极管及其制作方法
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Application No.: US10826304Application Date: 2004-04-19
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Publication No.: US07078780B2Publication Date: 2006-07-18
- Inventor: Shye-Lin Wu
- Applicant: Shye-Lin Wu
- Applicant Address: TW Hsinchu Hsien TW Hsin-Chu
- Assignee: Shye-Lin Wu,Chip Integration Tech., Co., Ltd.
- Current Assignee: Shye-Lin Wu,Chip Integration Tech., Co., Ltd.
- Current Assignee Address: TW Hsinchu Hsien TW Hsin-Chu
- Agency: Troxell Law Office, PLLC
- Main IPC: H01L31/62
- IPC: H01L31/62

Abstract:
A power Schottky rectifier device having a plurality of first trenches filled in with an un-doped polycrystalline silicon layer and each first trenches also has a p-region beneath the bottom of said first trenches to block out reverse current while a reverse biased is applied and to reduce minority carrier while forward biased is applied. Thus, the power Schottky rectifier device can provide first fast switch speed. The power Schottky rectifier device is formed with termination region at an outer portion of the substrate. The manufacture method is also provided.
Public/Granted literature
- US20050230744A1 Schottky barrier diode and method of making the same Public/Granted day:2005-10-20
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