Invention Grant
US07079373B2 Dielectric sheet, method for fabricating the dielectric sheet, printed circuit and patch antenna using the dielectric sheet, and method for fabricating the printed circuit 失效
电介质片,用于制造电介质片的方法,使用电介质片的印刷电路和贴片天线以及制造印刷电路的方法

  • Patent Title: Dielectric sheet, method for fabricating the dielectric sheet, printed circuit and patch antenna using the dielectric sheet, and method for fabricating the printed circuit
  • Patent Title (中): 电介质片,用于制造电介质片的方法,使用电介质片的印刷电路和贴片天线以及制造印刷电路的方法
  • Application No.: US10837461
    Application Date: 2004-04-30
  • Publication No.: US07079373B2
    Publication Date: 2006-07-18
  • Inventor: Gregory J. DunnJeffrey M. PetsingerJovica Savic
  • Applicant: Gregory J. DunnJeffrey M. PetsingerJovica Savic
  • Applicant Address: US IL Schaumburg
  • Assignee: Motorola, Inc.
  • Current Assignee: Motorola, Inc.
  • Current Assignee Address: US IL Schaumburg
  • Main IPC: H01G4/06
  • IPC: H01G4/06 H05K1/11
Dielectric sheet, method for fabricating the dielectric sheet, printed circuit and patch antenna using the dielectric sheet, and method for fabricating the printed circuit
Abstract:
A dielectric sheet (500, 600, 1621) includes a photodielectric support layer (505, 1630) that may be glass reinforced and a dielectric laminate (510, 605). The dielectric laminate includes first and second metal foil layers (415, 660; 210, 665, 1605, 1610), and a dielectric layer (405, 655, 1620) disposed between the first and second metal foil layers. The first metal foil layer is adhered to the photodielectric support layer. In a printed circuit and patch antenna that includes the dielectric sheet, the first metal layer is patterned by removal of metal according to a circuit pattern and the photodielectric support layer is patterned by removal of dielectric material according to the circuit pattern.
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