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公开(公告)号：US08111913B2
公开(公告)日：2012-02-07
申请号：US12212381
申请日：2008-09-17
申请人： Gregory J. Dunn , Boaz J. Super
发明人： Gregory J. Dunn , Boaz J. Super
IPC分类号： G06K9/00
CPC分类号： G06T11/001 , G06T7/11 , G06T7/194
摘要： A device and method of modifying an image containing a foreground and an original or substitute background are disclosed. Boundary pixels contain only the original background or the original background and the foreground. The original background is replaced by a predetermined or random color or by a color corresponding to the substitute background. The entire boundary pixel can be replaced by the replacement color. Alternatively, the ratio of the foreground to the original background can be estimated from the neighboring pixels and only the original background replaced by the replacement color. Once some or all of the boundary pixels are replaced, the image can be transmitted or otherwise transferred to other devices or viewers. Some or all of the images in a video can be modified.
摘要翻译： 公开了一种修改包含前景和原始或替代背景的图像的装置和方法。 边界像素仅包含原始背景或原始背景和前景。 原始背景由预定或随机颜色或与替代背景相对应的颜色代替。 整个边界像素可以替换为替换颜色。 或者，可以从相邻像素估计前景与原始背景的比率，并且只有由替换颜色替换的原始背景。 一旦部分或全部边界像素被替换，则图像可被传输或以其它方式传送到其他设备或观看者。 视频中的某些或全部图像可以修改。
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2.发明授权公开(公告)号：US08036716B2
公开(公告)日：2011-10-11
申请号：US12025182
申请日：2008-02-04
IPC分类号： H04Q1/00
CPC分类号： H04M1/6008 , G08B13/1672 , G08B25/08 , G10L21/0208 , G10L2021/02165 , H04M1/72536 , H04W4/90 , H04W76/50
摘要： A communication device contains multiple microphones that receive acoustic signals from a user and from the background. The acoustic signals from the user are enhanced using the background acoustic signals to reduce background noise. The enhanced signal are transmitted to an emergency network when an emergency call is made from the communication device. The raw signals are stored in the communication device for later retrieval or are transmitted simultaneously with the enhanced signals. The enhanced signals are transmitted using a circuit-switched voice mode while the raw signals are transmitted using a packet-switched voice mode.
摘要翻译： 通信设备包含接收来自用户和背景的声信号的多个麦克风。 使用背景声信号增强来自用户的声信号以减少背景噪声。 当从通信设备进行紧急呼叫时，增强的信号被发送到紧急网络。 原始信号存储在通信设备中以供以后检索，或者与增强信号同时发送。 使用电路交换语音模式发送增强信号，同时使用分组交换语音模式发送原始信号。
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公开(公告)号：US20100067782A1
公开(公告)日：2010-03-18
申请号：US12212381
申请日：2008-09-17
申请人： GREGORY J. DUNN , BOAZ J. SUPER
发明人： GREGORY J. DUNN , BOAZ J. SUPER
IPC分类号： G06K9/00
CPC分类号： G06T11/001 , G06T7/11 , G06T7/194
摘要： A device and method of modifying an image containing a foreground and an original or substitute background are disclosed. Boundary pixels contain only the original background or the original background and the foreground. The original background is replaced by a predetermined or random color or by a color corresponding to the substitute background. The entire boundary pixel can be replaced by the replacement color. Alternatively, the ratio of the foreground to the original background can be estimated from the neighboring pixels and only the original background replaced by the replacement color. Once some or all of the boundary pixels are replaced, the image can be transmitted or otherwise transferred to other devices or viewers. Some or all of the images in a video can be modified.
摘要翻译： 公开了一种修改包含前景和原始或替代背景的图像的装置和方法。 边界像素仅包含原始背景或原始背景和前景。 原始背景由预定或随机颜色或与替代背景相对应的颜色代替。 整个边界像素可以替换为替换颜色。 或者，可以从相邻像素估计前景与原始背景的比率，并且只有由替换颜色替换的原始背景。 一旦部分或全部边界像素被替换，则图像可被传输或以其它方式传送到其他设备或观看者。 视频中的某些或全部图像可以修改。
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公开(公告)号：US20100020473A1
公开(公告)日：2010-01-28
申请号：US12180768
申请日：2008-07-28
IPC分类号： H01G9/15
CPC分类号： H05K1/162 , H01G9/012 , H01G9/042 , H01G9/045 , H01G9/15 , H05K3/429 , H05K2201/0329 , H05K2201/0355 , H05K2201/09509 , H05K2201/09763 , H05K2201/09909 , H05K2203/0315 , Y10T29/417 , Y10T29/435
摘要： A process for forming a laminate with capacitance and the laminate formed thereby. The process includes the steps of providing a substrate and laminating a conductive foil on the substrate wherein the foil has a dielectric. A conductive layer is formed on the dielectric. The conductive foil is treated to electrically isolate a region of conductive foil containing the conductive layer from additional conductive foil. A cathodic conductive couple is made between the conductive layer and a cathode trace and an anodic conductive couple is made between the conductive foil and an anode trace.
摘要翻译： 一种用于形成具有电容的叠层的方法和由此形成的层压体。 该方法包括以下步骤：提供衬底并将导电箔层压在衬底上，其中箔具有电介质。 在电介质上形成导电层。 处理导电箔以将包含导电层的导电箔的区域与另外的导电箔电隔离。 在导电层和阴极迹线之间形成阴极导电对，并且在导电箔和阳极迹线之间形成阳极导电耦合。
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公开(公告)号：US07557304B2
公开(公告)日：2009-07-07
申请号：US11557711
申请日：2006-11-08
CPC分类号： H05K3/427 , H05K1/115 , H05K3/0032 , H05K3/0035 , H05K3/0038 , H05K3/0047 , H05K3/4602 , H05K2201/0394 , H05K2201/0959 , H05K2201/0969 , H05K2201/097 , H05K2201/09845 , H05K2203/1476
摘要： Closed vias are formed in a multilayer printed circuit board by laminating a dielectric layer to one side of a central core having a metal layer on each side. A second dielectric layer is laminated to the other side of the central core. Closed vias in the central core have been formed by drilling partially through but not completely penetrating the central core, and then completing the via from the opposite side with a hole that is much smaller in diameter to form a pathway that penetrates completely through the central core from one side to another. The via is then plated with metal to substantially close the smaller hole. Approximately one half of the closed vias are situated such that the closed aperture faces one dielectric layer and a remainder of the closed vias are situated such that the closed aperture faces the other dielectric layer. Resin from one dielectric layer fills the cavities of approximately one half of the closed vias, and resin from the other dielectric layer fills the circular cavities of the remainder of the closed vias. The total amount of resin migrated from each of the dielectric layers into the closed via cavities is approximately equal.
摘要翻译： 通过在每侧具有金属层的中心芯的一侧层叠电介质层，在多层印刷电路板中形成封闭的通孔。 第二电介质层被层压到中心芯的另一侧。 已经通过部分地穿过但不完全穿透中心芯而形成中心芯上的闭合的通孔，然后通过直径小得多的孔从相对侧完成通孔，以形成完全穿透中心芯的通路 从一边到另一边。 然后通孔用金属电镀以基本上闭合较小的孔。 闭合通孔的大约一半被定位成使得闭合孔面对一个电介质层，并且其余的封闭通孔被定位成使得闭合孔面对另一介电层。 来自一个介电层的树脂填充了大约一半的封闭通孔的空腔，而另一个介电层的树脂填充了其余的封闭通孔的圆形空腔。 从每个介电层迁移到封闭通孔中的树脂的总量近似相等。
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公开(公告)号：US07459202B2
公开(公告)日：2008-12-02
申请号：US11428454
申请日：2006-07-03
CPC分类号： H05K3/428 , H05K1/116 , H05K3/0008 , H05K3/0047 , H05K3/025 , H05K3/205 , H05K3/427 , H05K2201/09063 , H05K2201/09918 , H05K2203/1438 , Y10T428/24917
摘要： A sequentially laminated printed circuit board having highly reliable vias can be fabricated by pattern plating flanges or via lands on a copper foil, laminating the foil to a prepreg so that the flanges are embedded into the surface of the prepreg, creating via holes in the laminate that are substantially concentric with the individual flanges, plating the via holes with copper, chemically or mechanically milling off a portion of the copper plating and optionally some of the copper foil to reduce the overall thickness of the laminate, and laminating a second and optionally a third prepreg to the laminate. The resulting printed circuit board has the flanges embedded in the surface of the laminate so that the inside wall of the flange is electrically and mechanically attached to the outside wall of the plated through hole barrel.
摘要翻译： 具有高度可靠的通孔的顺序层压的印刷电路板可以通过铜箔上的图案电镀法兰或通孔焊盘来制造，将箔层压到预浸料上，使得凸缘嵌入预浸料的表面中，从而在层压板中形成通孔 其与各个凸缘基本同心，用铜电镀通孔，化学或机械地研磨铜镀层的一部分和任选的一些铜箔以减小层压体的总厚度，并层压第二和任选的 第三预浸料。 所得到的印刷电路板具有嵌入在层压体的表面中的凸缘，使得凸缘的内壁电连接和机械地附接到电镀通孔筒的外壁。
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公开(公告)号：US07451540B2
公开(公告)日：2008-11-18
申请号：US11552368
申请日：2006-10-24
CPC分类号： H05K3/20 , H05K1/167 , H05K3/06 , H05K3/205 , H05K3/244 , H05K2201/0361 , H05K2203/0376 , H05K2203/0384 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49144 , Y10T29/49155 , Y10T29/49156
摘要： Fabricating (100, 1300) a printed circuit board includes fabricating patterned conductive traces (305, 310, 1410, 1415) onto a foil, laminating the patterned conductive traces to a printed circuit board substrate (405, 1505) by pressing on the foil, such that the conductive traces are pressed into a dielectric layer of the printed circuit board, and removing the foil to expose a co-planar surface of conductive trace surfaces and dielectric surfaces. Removal may be done by peeling (125) and/or etching (130, 1315).
摘要翻译： 制造（100,1300）印刷电路板包括在箔上制造图案化的导电迹线（305,310,1410,1415），通过压在箔上将图案化的导电迹线层压到印刷电路板衬底（405,1505）上， 使得导电迹线被压入印刷电路板的电介质层，并且去除箔以暴露导电迹线表面和电介质表面的共面表面。 可以通过剥离（125）和/或蚀刻（130,1315）进行去除。
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公开(公告)号：US20080273291A1
公开(公告)日：2008-11-06
申请号：US12098593
申请日：2008-04-07
申请人： Keith R. Brenneman , Chris Wayne , Chris Stolarski , John T. Kinard , Alethia Melody , Gregory J. Dunn , Remy J. Chellni , Robert T. Croswell
发明人： Keith R. Brenneman , Chris Wayne , Chris Stolarski , John T. Kinard , Alethia Melody , Gregory J. Dunn , Remy J. Chellni , Robert T. Croswell
IPC分类号： H01G9/00
CPC分类号： H01G9/15 , H01G9/0029 , Y10T29/417
摘要： An improved method for forming a capacitor. The method includes: providing a carrier with a channel therein; providing a metal foil with a valve metal with a first dielectric on a first face of the metal foil; securing the metal foil into the channel with the first dielectric away from a channel floor; inserting an insulative material between the metal foil and each side wall of the channel; forming a cathode layer on the first dielectric between the insulative material; forming a conductive layer on the cathode layer and in electrical contact with the carrier; lap cutting the carrier parallel to the metal foil such that the valve metal is exposed; and dice cutting to form singulated capacitors.
摘要翻译： 一种形成电容器的改进方法。 该方法包括：在其中提供具有通道的载体; 在所述金属箔的第一面上提供具有第一电介质的阀金属的金属箔; 将金属箔固定到通道中，使第一电介质远离通道底板; 在金属箔和通道的每个侧壁之间插入绝缘材料; 在绝缘材料之间的第一电介质上形成阴极层; 在阴极层上形成导电层并与载体电接触; 搭载平行于金属箔的载体，使得阀金属暴露; 和骰子切割以形成单个电容器。
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公开(公告)号：US20080148561A1
公开(公告)日：2008-06-26
申请号：US11615932
申请日：2006-12-22
IPC分类号： H01R43/00
CPC分类号： H05K3/0035 , H05K3/0047 , H05K3/4652 , H05K2201/0187 , H05K2203/0554 , H05K2203/063 , H05K2203/1476 , Y10T29/49165
摘要： A method of making a multilayer, printed wiring board may include pre-drilling a prepreg sheet to form a hole free of glass fibers. The hole has a first diameter. The method includes laminating the pre-drilled prepreg sheet between a copper foil and a substrate and allowing the hole to fill with resin from the prepreg sheet, patterning the copper foil to create an opening in a location associated with the resin-filled hole, drilling a via hole in the resin-filled hole, and metallizing the copper foil and the via hole. The via hole has a second diameter smaller than the first diameter.
摘要翻译： 制造多层印刷电路板的方法可以包括预先浸渍预浸料片以形成没有玻璃纤维的孔。 孔具有第一直径。 该方法包括在铜箔和基材之间层压预先预浸的预浸料片，并允许该孔从预浸料片填充树脂，图案化铜箔以在与树脂填充孔相关的位置形成开口 树脂填充孔中的通孔，铜箔和通孔的金属化。 通孔具有小于第一直径的第二直径。
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公开(公告)号：US06841080B2
公开(公告)日：2005-01-11
申请号：US10352483
申请日：2003-01-28
申请人： Angus Kingon , Gregory J. Dunn , Stephen Streiffer , Kevin Cheek , Min-Xian Zhang , Jon-Paul Maria , Jovica Savic
发明人： Angus Kingon , Gregory J. Dunn , Stephen Streiffer , Kevin Cheek , Min-Xian Zhang , Jon-Paul Maria , Jovica Savic
CPC分类号： H05K1/162 , H01G4/1218 , H05K2201/0175 , H05K2201/0179 , H05K2201/0355 , H05K2201/09509 , H05K2203/121 , Y10T29/417
摘要： A dielectric film is formed on a free-standing conductive metal layer to form a multi-layer foil comprising a conductive metal layer, a barrier layer and a dielectric oxide layer. Such multi-layer foils are mechanically flexible, and useful for the manufacture of capacitors. Examples of barrier layers include Ni—P or Ni—Cr alloys. After a second layer of conductive metal is deposited on a dielectric oxide surface opposing the first conductive metal layer, the resulting capacitor foil is processed into a capacitor. The resulting capacitor is a surface mounted capacitor or is formed as a integrated or embedded capacitor within a circuit board.
摘要翻译： 在独立的导电金属层上形成电介质膜以形成包含导电金属层，阻挡层和电介质氧化物层的多层箔。 这种多层箔是机械灵活的，并且可用于制造电容器。 阻挡层的实例包括Ni-P或Ni-Cr合金。 在与第一导电金属层相对的电介质氧化物表面上沉积第二层导电金属之后，将所得电容器箔加工成电容器。 所得到的电容器是表面安装的电容器，或者形成为电路板内的集成或嵌入式电容器。
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