- 专利标题： MEMS and method of manufacturing MEMS
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申请号： US10793653申请日： 2004-03-04
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公开(公告)号： US07081657B2公开(公告)日： 2006-07-25
- 发明人: Sadeg M. Faris
- 申请人： Sadeg M. Faris
- 申请人地址： US NY Elmsford
- 专利权人： Reveo, Inc.
- 当前专利权人： Reveo, Inc.
- 当前专利权人地址： US NY Elmsford
- 代理商 Ralph J. Crispino
- 主分类号： H01L29/84
- IPC分类号： H01L29/84
摘要：
The present invention relates to micro electro-mechanical systems (MEMS) and production methods thereof, and more particularly to vertically integrated MEMS systems. Manufacturing of MEMS and vertically integrated MEMS is facilitated by forming, preferably on a wafer level, plural MEMS on a MEMS layer selectively bonded to a substrate, and removing the MEMS layer intact.
公开/授权文献
- US20040253794A1 MEMS and method of manufacturing MEMS 公开/授权日：2004-12-16
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