发明授权
US07087441B2 Method of making a circuitized substrate having a plurality of solder connection sites thereon
失效
制造其上具有多个焊接连接部位的电路化基板的方法
- 专利标题： Method of making a circuitized substrate having a plurality of solder connection sites thereon
- 专利标题（中）： 制造其上具有多个焊接连接部位的电路化基板的方法
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申请号： US10968929申请日： 2004-10-21
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公开(公告)号： US07087441B2公开(公告)日： 2006-08-08
- 发明人: John J. Konrad , Joseph A. Kotylo , Jose A. Rios
- 申请人： John J. Konrad , Joseph A. Kotylo , Jose A. Rios
- 申请人地址： US NY Endicott
- 专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人地址： US NY Endicott
- 代理机构： Hinman, Howard & Kattell, LLP
- 代理商 Lawrence R. Fraley
- 主分类号： G01R31/26
- IPC分类号： G01R31/26 ; H01L21/66
摘要：
A method of making a circuitized substrate in which two solder deposits, either of the same or different metallurgies, are formed on at least two different metal or metal alloy conductors and PTHs. In an alternative embodiment, the same solder compositions may be deposited on conductor and PTHs of different metal or metal alloy composition. In each embodiment, a single commoning layer (e.g., copper) is used, being partially removed following the first deposition. The solder is deposited using an electroplating process (electroless or electrolytic) and the commoning bar in both depositing steps. An information handling system utilizing the circuitized substrate formed in accordance with the invention is also described.
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