Invention Grant
- Patent Title: Pressure sensor device and method of producing the same
- Patent Title (中): 压力传感器装置及其制造方法
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Application No.: US10744097Application Date: 2003-12-24
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Publication No.: US07089799B2Publication Date: 2006-08-15
- Inventor: Takashi Nomura , Keiji Horiba , Tetsuo Fujii
- Applicant: Takashi Nomura , Keiji Horiba , Tetsuo Fujii
- Applicant Address: JP Kariya
- Assignee: Denso Corporation
- Current Assignee: Denso Corporation
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2002-372094 20021224; JP2003-366140 20031027
- Main IPC: G01L7/00
- IPC: G01L7/00
Abstract:
A pressure sensor device having a casing (10) accommodating a sensor element (20) mounted on a mounting member (30). The casing (10) includes an opening (11) in one surface thereof. The sensor element (20) is arranged in the opening (11) for measuring the pressure outside of the casing. The casing (10) is preferably mounted on the circuit board, which is the mounting member (30). The casing (10) is mounted on the circuit board in such a state that the opening side (11) faces the circuit board.
Public/Granted literature
- US20040163477A1 Pressure sensor device and method of producing the same Public/Granted day:2004-08-26
Information query
