- 专利标题： Semiconductor device and method for producing the same by dicing
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申请号： US10896042申请日： 2004-07-22
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公开(公告)号： US07091109B2公开(公告)日： 2006-08-15
- 发明人: Tetsuo Fujii , Hiroshi Muto , Shinji Yoshihara , Sumitomo Inomata
- 申请人： Tetsuo Fujii , Hiroshi Muto , Shinji Yoshihara , Sumitomo Inomata
- 申请人地址： JP Kariya
- 专利权人： Denso Corporation
- 当前专利权人： Denso Corporation
- 当前专利权人地址： JP Kariya
- 代理机构： Posz Law Group, PLC
- 优先权： JP11-76566 19990319; JP11-196345 19990709
- 主分类号： H01L21/46
- IPC分类号： H01L21/46 ; H01L21/50
摘要：
A protective sheet is fixed to a jig, and regions of the protective sheet corresponding to regions where dicing-cut is to be performed are removed to form grooves. Then, a semiconductor wafer is bonded to the protective sheet at an opposite side of the jig, and the jig is detached from the protective sheet and the semiconductor wafer bonded together. After that, the semiconductor wafer is cut into semiconductor chips by dicing along the grooves of the protective sheet. Because the protective sheet is not cut by dicing, no scraps of the protective sheet is produced, thereby preventing contamination to the chips.
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