发明授权
- 专利标题: Heat treatment apparatus by means of light irradiation
- 专利标题(中): 热处理装置通过光照射
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申请号: US10780420申请日: 2004-02-17
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公开(公告)号: US07091453B2公开(公告)日: 2006-08-15
- 发明人: Hiromi Murayama , Tatsufumi Kusuda
- 申请人: Hiromi Murayama , Tatsufumi Kusuda
- 申请人地址: JP
- 专利权人: Dainippon Screen Mfg. Co., Ltd.
- 当前专利权人: Dainippon Screen Mfg. Co., Ltd.
- 当前专利权人地址: JP
- 代理机构: Ostrolenk, Faber, Gerb & Soffen, LLP
- 优先权: JP2003-050896 20030227; JP2003-114036 20030418
- 主分类号: F27B5/14
- IPC分类号: F27B5/14
摘要:
A chamber has a wall surface fitted with a liner. The liner is removably provided to the chamber with no fixed relation therebetween. By simply opening a light source to remove a heat diffusion plate, a hot plate and a tubular member from the chamber, the liner can be easily detached accordingly from the chamber. When a semiconductor wafer cracks to litter the chamber with its fragments, the chamber can be easily cleaned by simply detaching the liner. The liner has an outer surface subjected to surface roughening by honing. When a flash lamp emits flashlight of considerably high intensity, the roughened outer surface of the liner serves to block this flashlight. As a result, the metal surface inside the chamber is prevented from being exposed to the flashlight emitted from the flash lamp.
公开/授权文献
- US20040169032A1 Heat treatment apparatus by means of light irradiation 公开/授权日:2004-09-02
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