发明授权
US07091546B2 Semiconductor memory with trench capacitor and method of fabricating the same
失效
具有沟槽电容器的半导体存储器及其制造方法
- 专利标题: Semiconductor memory with trench capacitor and method of fabricating the same
- 专利标题(中): 具有沟槽电容器的半导体存储器及其制造方法
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申请号: US11038173申请日: 2005-01-21
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公开(公告)号: US07091546B2公开(公告)日: 2006-08-15
- 发明人: Mitsuru Sato , Hirofumi Inoue , Masaru Kito
- 申请人: Mitsuru Sato , Hirofumi Inoue , Masaru Kito
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- 优先权: JP2004-012883 20040121
- 主分类号: H01L29/772
- IPC分类号: H01L29/772
摘要:
A semiconductor device includes semiconductor substrate, a trench capacitor formed in the semiconductor substrate, a cell transistor formed so as to the trench capacitor and having a gate electrode formed on the semiconductor substrate and a source/drain region formed in a surface of the semiconductor substrate, an impurity diffusion region formed in the semiconductor substrate so as to be electrically connected between the trench capacitor and the source/drain region, and a Ge inclusion region formed between the impurity diffusion region and the trench capacitor.
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