发明授权
US07093206B2 Computer aided design method and apparatus for modeling and analyzing on-chip interconnect structures
失效
用于对片上互连结构进行建模和分析的计算机辅助设计方法和装置
- 专利标题： Computer aided design method and apparatus for modeling and analyzing on-chip interconnect structures
- 专利标题（中）： 用于对片上互连结构进行建模和分析的计算机辅助设计方法和装置
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申请号： US10690238申请日： 2003-10-21
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公开(公告)号： US07093206B2公开(公告)日： 2006-08-15
- 发明人: Minakshisundaran B. Anand , Matthew S. Angyal , Alina Deutsch , Ibrahim M. Elfadel , Gerard V. Kopcsay , Barry J. Rubin , Howard H. Smith
- 申请人： Minakshisundaran B. Anand , Matthew S. Angyal , Alina Deutsch , Ibrahim M. Elfadel , Gerard V. Kopcsay , Barry J. Rubin , Howard H. Smith
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corp.
- 当前专利权人： International Business Machines Corp.
- 当前专利权人地址： US NY Armonk
- 代理机构： Law Office of Charles W. Peterson, Jr.
- 代理商 Louis J. Percello, Esq.; Satheesh K. Karra, Esq.
- 主分类号： G06F17/50
- IPC分类号： G06F17/50
摘要：
A computer aided design (CAD) system. A template generation engine generates templates from interconnect configuration files. A field solver generates high frequency passive element relationships from the templates. A circuit builder generates circuit description files from device technology models and from high frequency passive element relationships. Parameterized circuit description models may be generated for large range of sensitivity analyses. A simulator simulates circuit responses for transmission line models from the circuit description files. Interconnect configuration files may be generated by a geometry and material definition module that receives process description data from a designer.
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