Invention Grant
- Patent Title: Supporting frame for surface-mount diode package
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Application No.: US10308274Application Date: 2002-12-03
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Publication No.: US07095101B2Publication Date: 2006-08-22
- Inventor: Jiahn-Chang Wu
- Applicant: Jiahn-Chang Wu
- Agency: Patent Agent
- Agent H. C. Lin
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L33/00
Abstract:
A supporting frame is used to solidly bridge to the two metallic contacts of a surface mount diode chip. Any bending or twisting stress between the two contacts is borne by the supporting frame instead of the diode chip. Otherwise the stress may damage the diode chip.
Public/Granted literature
- US20030116838A1 Supporting frame for surface-mount diode package Public/Granted day:2003-06-26
Information query
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