公开(公告)号：US07887229B2

公开(公告)日：2011-02-15

申请号：US11952639

申请日：2007-12-07

Applicant: Jiahn-Chang Wu

Inventor： Jiahn-Chang Wu

IPC: H01R33/00 ,  F21V31/00

CPC classification number: F21V23/06 ,  F21K9/00 ,  F21V15/01 ,  F21V19/001 ,  F21V19/042 ,  F21V31/00 ,  F21Y2115/10 ,  H01R33/09 ,  H01R33/965

Abstract: A waterproof ring unit is located in the opening of a socket. A ring ditch is made around the inner surface of the waterproof ring unit. When a flanged light emitting diode (LED) lamp is inserted into the socket, the ring ditch structurally couples to the flange. The waterproof ring embraces the lamp body to form a waterproof module for the LED lamp.

Abstract translation: 防水环单元位于插座的开口中。 在防水环单元的内表面周围形成环沟。 当法兰的发光二极管（LED）灯插入插座时，环沟结构地耦合到法兰。 防水环包围灯体，形成LED灯的防水模块。

公开(公告)号：US07806556B2

公开(公告)日：2010-10-05

申请号：US12041109

申请日：2008-03-03

Applicant: Jiahn-Chang Wu

Inventor： Jiahn-Chang Wu

IPC: F21V1/00

CPC classification number: F21V29/004 ,  F21V29/505 ,  F21V29/70 ,  F21V29/74 ,  F21V29/89 ,  F21Y2115/10

Abstract: A metal base has a mounting hole made in the wall for housing a light unit, and a reflection surface opposite to the hole for reflecting the light from the light unit to form a reflection lamp with high heat dissipation ability.

Abstract translation: 金属基座具有在壁上形成的用于容纳光单元的安装孔和与孔相对的反射面，用于反射来自光单元的光，以形成具有高散热能力的反射灯。

公开(公告)号：US07586247B2

公开(公告)日：2009-09-08

申请号：US11107267

申请日：2005-04-18

Applicant: Jiahn-Chang Wu

Inventor： Jiahn-Chang Wu

IPC: H01J1/00

CPC classification number: H01L25/167 ,  H01L33/02 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A thin resistive layer is connected in series and integrated with a light emitting device as a ballast to stabilize the current through the light emitting device.

Abstract translation: 薄电阻层串联连接并与作为镇流器的发光器件集成，以稳定通过发光器件的电流。

公开(公告)号：US07397133B2

公开(公告)日：2008-07-08

申请号：US10847225

申请日：2004-05-18

Applicant: Jiahn-Chang Wu

Inventor： Jiahn-Chang Wu

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L33/486 ,  H01L24/73 ,  H01L33/62 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12041 ,  H05K1/112 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: A submount is used to mount a diode between two metal areas on the upper surface of a substrate. One of the areas is connected to a metal plate at the lower surface of the substrate through a via. The submount is clamped between two metal sheets. The top metal sheet has a through-hole for anchoring and self-aligning the diode. The electrodes of the diode are each coupled to one of the clamping metal sheets. Clamping metals provide pressure contact without soldering to the contact. But soldering can be alternatively used to enhance product reliability. Either the top metal sheet or the bottom metal sheet can be fully or selectively coating of solder for batch soldering at the contact point upon heating. The large metal plates and the large metal clamping sheets provide good heat sink and speedy soldering.

公开(公告)号：US07095101B2

公开(公告)日：2006-08-22

申请号：US10308274

申请日：2002-12-03

Applicant: Jiahn-Chang Wu

Inventor： Jiahn-Chang Wu

IPC: H01L23/02 ,  H01L33/00

CPC classification number: H01L23/49562 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49555 ,  H01L33/486 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2224/05599

Abstract: A supporting frame is used to solidly bridge to the two metallic contacts of a surface mount diode chip. Any bending or twisting stress between the two contacts is borne by the supporting frame instead of the diode chip. Otherwise the stress may damage the diode chip.

公开(公告)号：US6008529A

公开(公告)日：1999-12-28

申请号：US104762

申请日：1998-06-25

Applicant: Jiahn-Chang Wu

Inventor： Jiahn-Chang Wu

IPC: H01S5/02 ,  H01S5/022 ,  H01S5/042 ,  H01S5/40 ,  H01L23/495 ,  H01L23/02

CPC classification number: H01S5/0201 ,  H01S5/0224 ,  H01L2224/73265 ,  H01S5/02276

Abstract: A surface mount semiconductor laser diode package has a substrate on which the laser diode is mounted. The top electrode of the laser diode is wire-bonded to the top end of a plated-through conduit through the substrate, and the bottom end of the plated-through conduit is connected to a circuit contact plated at the bottom surface of the substrate. The bottom electrode of the laser diode is flip-chip mounted to the top end of another plated-through conduit, and bottom end of the second plated-through conduit is connected to a second circuit contact. Each laser diode is covered with a transparent lid or a lid with a lens. For mass production, a large number of the laser diodes arranged in a matrix formation are mounted on a common substrate. Walls are erected around each laser diode. A transparent cover is placed over the walls. All the plated-through conduits at the edges of the laser diodes in a same column are aligned and sawed through together.

Abstract translation: 表面贴装半导体激光二极管封装具有安装有激光二极管的基板。 激光二极管的顶部电极通过衬底线接合到电镀穿通导管的顶端，并且电镀穿通导管的底端连接到电镀在衬底底表面上的电路触点。 激光二极管的底部电极倒装芯片安装到另一个电镀通孔的顶端，第二电镀通孔的底端连接到第二电路触点。 每个激光二极管被透明的盖子或带有透镜的盖子覆盖。 为了大规模生产，将大量以矩阵形式布置的激光二极管安装在公共基板上。 围绕每个激光二极管竖立墙壁。 透明的盖子放在墙壁上。 激光二极管在同一列的边缘处的所有电镀通孔导线对齐并锯切在一起。

公开(公告)号：US07527391B2

公开(公告)日：2009-05-05

申请号：US11458810

申请日：2006-07-20

Applicant: Jiahn-Chang Wu

Inventor： Jiahn-Chang Wu

IPC: F21S6/00

CPC classification number: F21V19/001 ,  F21K9/00 ,  F21S41/00 ,  F21V19/04 ,  F21V19/042 ,  F21Y2115/10 ,  G09F13/04 ,  Y10S362/80

Abstract: A lighting board is made with a receptacle substrate accommodated to accept cassette light units. The convenience of assembly and disassembly of the light unit from the receptacle substrate makes the product easily to be maintained for changing different color light units, changing different displaying patterns, remove or replace a failed light unit in the lighting board.

Abstract translation: 照明板制成具有容纳基座以容纳盒式光盘单元。 将灯单元从插座基板的组装和拆卸的便利性使得容易维护产品以改变不同的颜色的光单元，改变不同的显示图案，去除或更换照明板中的故障照明单元。

公开(公告)号：US07276741B2

公开(公告)日：2007-10-02

申请号：US11728610

申请日：2007-03-27

Applicant: Jiahn-Chang Wu

Inventor： Jiahn-Chang Wu

IPC: H01L33/00 ,  H01L27/15 ,  H01L31/12

CPC classification number: H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: The leads of a light emitting diode are made coaxial. The inner lead protrudes lower than the outer lead. The package is inserted into a spongy display panel for power supply. The display panel has three layers: a lower conducting layer for contacting said inner lead and a top conducting layer for contacting said outer layer, and an insulating layer between the top and the bottom layer. For LED with a bottom electrode and a top electrode, the LED can be mounted on the planar tops of the inner lead and the top electrode wire bonded to the outer lead, or the LED can be mounted on the side surface of the inner lead and the top electrode wire bonded to the outer lead. For LED with two bottom electrode, the LED electrodes can straddle over the planar tops of the inner lead and the outer lead, or the LED electrodes can straddle over the telescopic side surfaces of the two leads.

Abstract translation: 发光二极管的引线是同轴的。 内引线比外引线突出。 将包装插入海绵状显示面板供电。 显示面板具有三层：用于接触所述内引线的下导电层和用于接触所述外层的顶导电层，以及顶层和底层之间的绝缘层。 对于具有底部电极和顶部电极的LED，LED可以安装在内部引线和连接到外部引线的顶部电极引线的平面顶部上，或者LED可以安装在内部引线的侧表面上， 顶部电极引线接合到外部引线。 对于具有两个底部电极的LED，LED电极可以跨越内部引线和外部引线的平面顶部，或者LED电极可跨越两个引线的伸缩侧表面。

公开(公告)号：US07193303B2

公开(公告)日：2007-03-20

申请号：US11199925

申请日：2005-08-10

Applicant: Jiahn-Chang Wu

Inventor： Jiahn-Chang Wu

IPC: H01L23/02 ,  H01L33/00

CPC classification number: H01L23/49562 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49555 ,  H01L33/486 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2224/05599

Abstract: A supporting frame is used to solidly bridge to the two metallic contacts of a surface mount diode chip. Any bending or twisting stress between the two contacts is borne by the supporting frame instead of the diode chip. Otherwise the stress may damage the diode chip. wherein said supporting forms a cantilever over said first metallic contact and the overhanging end of the cantilever is glued to said second metallic contact.

Abstract translation: 支撑框架用于牢固地桥接到表面贴装二极管芯片的两个金属触点。 两个触点之间的任何弯曲或扭转应力都由支撑框架代替二极管芯片承担。 否则应力可能会损坏二极管芯片。 其中所述支撑件在所述第一金属接触件上形成悬臂，并且所述悬臂的悬伸端部胶合到所述第二金属接触件。

公开(公告)号：US07166868B2

公开(公告)日：2007-01-23

申请号：US11041535

申请日：2005-01-25

Applicant: Jiahn-Chang Wu

Inventor： Jiahn-Chang Wu

IPC: H01L27/15

CPC classification number: H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L2924/00014

Abstract: The electrodes of a light emitting diode (LED) is coupled to the terminals of a package with solderless pressure contacts. Each package is housed in a module with a bed on which the bottom electrode of the LED rests, and a pressure plate which is coupled to the top electrode of the LED. The pressure plate slides along four vertical posts to exert pressure to an LED package against a bed to form solderless pressure contacts. A plurality of LED packages can be lined up in a row to form a light strip, with the top pressure plate extended to form the bed of an adjacent module. A plurality of LED packages can also be arranged a matrix array display panel, where a plurality of lower terminals rests on one row of common bed of a number of parallel horizontal common beds, and where a plurality of upper terminals are pressed under a column of parallel vertical common pressure plates, so that any individual LED at the cross-point of a common bed and a common pressure can be randomly accessed.

Abstract translation: 发光二极管（LED）的电极与无焊压接触件连接到封装的端子。 每个包装被容纳在具有其上的LED的底部电极所在的床的模块中，以及联接到LED的顶部电极的压力板。 压板沿着四个垂直柱滑动，以将压力施加到针对床的LED封装以形成无焊接压力接触。 多个LED封装可以排列成一排以形成一个光条，顶部压板延伸以形成相邻模块的床。 多个LED封装也可以布置成矩阵阵列显示面板，其中多个下端子搁置在多个平行水平公共床的一排公共床上，并且其中多个上端子被压在一列 平行的垂直公共压力板，使得可以随机访问公共床的交叉点处的任何单独的LED和共同的压力。