Invention Grant
US07095123B2 Sensor semiconductor package, provided with an insert, and method for making same
有权
具有插入件的传感器半导体封装及其制造方法
- Patent Title: Sensor semiconductor package, provided with an insert, and method for making same
- Patent Title (中): 具有插入件的传感器半导体封装及其制造方法
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Application No.: US10466191Application Date: 2002-01-10
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Publication No.: US07095123B2Publication Date: 2006-08-22
- Inventor: Christophe Prior
- Applicant: Christophe Prior
- Applicant Address: FR Montrouge
- Assignee: STMicroelectronics SA
- Current Assignee: STMicroelectronics SA
- Current Assignee Address: FR Montrouge
- Agency: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
- Agent Lisa K. Jorgenson
- Priority: FR0100473 20010115
- International Application: PCT/FR02/00069 WO 20020110
- International Announcement: WO02/056388 WO 20020718
- Main IPC: H01L23/28
- IPC: H01L23/28
Abstract:
A semiconductor package includes a mounting and electrical connection plate, and a semiconductor component having front and rear surfaces and including a sensor. The rear surface of the semiconductor component is attached to the mounting and electrical connection plate and the front surface is attached to the sensor. An insert is adjacent the front face of the semiconductor component and the sensor and has an access passage for exposing the sensor. A plug is in the access passage of the insert. A body of encapsulation material surrounds the mounting and electrical connection plate, the semiconductor component and the insert.
Public/Granted literature
- US20040077118A1 Sensor semiconductor package, provided with an insert, and method for making same Public/Granted day:2004-04-22
Information query
IPC分类:
