A molding apparatus includes an upper mold tool having an upper-most mold half, a lower mold tool having a lowermost mold half, and an intermediate mold tool having a first auxiliary mold half cooperating with the uppermost mold half and a second auxiliary mold half cooperating with the lowermost mold half. In a first molding step, the intermediate mold tool is positioned between the upper and lower mold tools to form a first mold cavity between the upper and intermediate mold tools and a second mold cavity between the intermediate and lower mold tools. In this molding step upper and lower material layers are individually pre-molded in the two cavities. In a second molding step, the intermediate mold tool is moved laterally away, and the upper and lower mold tools are moved directly into molding cooperation with each other. Thereby, the separately pre-molded upper and lower material layers are brought together, laminated, bonded, and molded to produce a finished, two-layered molded component.